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Binder systems containing alkoxysilane groups-carrying prepolymers and epoxide compounds, and the use thereof

An alkoxysilyl, epoxy compound technology, applied in the direction of polyether adhesives, polyurea/polyurethane adhesives, adhesive types, etc., to achieve the effect of simple operation

Inactive Publication Date: 2018-07-17
EVONIK DEGUSSA GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The prior art lacks the ability to combine the performance benefits of alkoxysilyl-functionalized polymers and epoxies (i.e., high ductility, high elasticity, and through-cure, as well as high adhesion to different substrates, high mechanical load-bearing ability and stability) combined curable system

Method used

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  • Binder systems containing alkoxysilane groups-carrying prepolymers and epoxide compounds, and the use thereof
  • Binder systems containing alkoxysilane groups-carrying prepolymers and epoxide compounds, and the use thereof
  • Binder systems containing alkoxysilane groups-carrying prepolymers and epoxide compounds, and the use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0149] Embodiment 1: synthesis

[0150] Silyl polyether SP1 (side-chain alkoxysilyl functionalized polyether):

[0151] 353 g of polypropylene glycol with an average molar mass of 2000 g / mol were added to a 5-liter autoclave, and this initial charge was mixed with 150 ppm (relative to the total charge) of a zinc hexacyanocobaltate double metal cyanide catalyst. The reactor atmosphere was made inert by injecting nitrogen to a pressure of 3 bar and then depressurizing to standard atmospheric pressure. This operation was repeated two more times. While stirring, the reactor contents were heated to 130°C and evacuated to about 20 mbar to remove volatile components. After 30 minutes, the catalyst was activated by metering 80 g of propylene oxide into the evacuated reactor. The internal pressure first rises to about 0.8 bar. After about 6 minutes, the reaction started to take place as indicated by a drop in reactor pressure. Then 1218 g of propylene oxide were metered in con...

Embodiment 2

[0179] Example 2: Composition

Embodiment 21

[0180] Example 2.1: Preparation of one-component composition without filling

[0181] In all compositions in Table 3, 0.5 g TIB-Kat 223 and 3.0 g per 100 g of silyl polyether were used AMEO. place each component in Mix well in FVS 600 (from Hausschild). Specimens for lap adhesion (Example 3, Table 5) and elongation at break (Table 7) were prepared immediately after mixing. The type and consumption (all relative to 100g silyl polyether) of epoxide and curing agent are listed in Table 3:

[0182] Table 3: Composition Table of Unfilled One-Component Compositions

[0183]

[0184]

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Abstract

The invention relates to curable mixtures containing at least one binder composition and at least one curing agent mixture and optionally one or more alkoxysilane compounds, and the use thereof.

Description

technical field [0001] The present invention relates to curable mixtures comprising at least one adhesive composition together with at least one curing agent mixture and optionally one or more alkoxysilane compounds, and their use. Background technique [0002] Polymers bearing alkoxysilyl groups such as polyethers, polysiloxanes or polyurethanes have long been known and are used as binders in moisture-curing adhesive / sealant formulations. In the cured state, adhesives / sealants are known for their high ductility and elasticity, but they often lack sufficient mechanical strength and effective adhesion on critical substrates such as plastics. Especially when applied in relatively thick layers and under conditions of low ambient humidity, cure through the volume of the material is slow, and the surface often lacks sufficient freedom for adhesion. This is especially true for widely used silyl-terminated polymers due to their low density of reactive alkoxysilyl functional groups...

Claims

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Application Information

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IPC IPC(8): C08G65/22C08G65/336C09J163/00C09J171/02C08L63/00C08G18/50
CPCC08G18/5096C08G65/22C08G65/336C09J163/00C08L63/00C08G18/755C08G18/246C08G18/283C09J175/08C08G2190/00C08L71/02C09J171/02C08K5/29C08K5/5419
Inventor F·舒伯特W·克诺特F·格里梅尔特A·莱温
Owner EVONIK DEGUSSA GMBH