Half-metal preparation process of MnAs/GaAs-based interface
A preparation process and semi-metal technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as backward methods and achieve good market application value
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[0019] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0020] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
[0021] Unless otherwise defined, all technical and sc...
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