Nitride light emitting diode structure
A technology of light-emitting diodes and nitrides, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of reducing the internal quantum efficiency of LEDs and low internal quantum efficiency, and achieve the effect of improving internal quantum efficiency and increasing the probability of tunneling
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Embodiment 1
[0022] Such as figure 1 As shown, the substrate 100 is a silicon (Si) substrate, the buffer layer 200 is AlN, and the N-type layer 300 is Si-doped with a concentration of 2×10 18 ~5×10 18 cm -3 GaN, the preparation layer 400 is In with a thickness of 80nm-100nm 0.05 Ga 0.95 N single-layer structure; the first multi-quantum well layer 500 is 4 periods of In x Ga (1-x) N / GaN periodic structure, wherein the thickness of the GaN quantum barrier is 15nm; the second multi-quantum well layer 600 is 4 periods of In x Ga (1-x) N / GaN periodic structure, wherein the thickness of the GaN quantum barrier is 10nm; 19 cm -3 Al 0.2 Ga 0.8 N; P-type layer 800 is doped with Mg concentration 1×10 20 cm -3 GaN.
Embodiment 2
[0024] Such as figure 2 As shown, the substrate 100 is made of sapphire (Al 2 o 3 ) substrate, the buffer layer 200 is low-temperature GaN, and the N-type layer 300 is doped with Si concentration 5×10 18 ~1×10 19 cm -3 GaN; preparation layer 400 is In 0.05 Ga 0.95 N / GaN periodic structure, the number of periods is 20-30; the first multi-quantum well layer 500 is 3 periods of In x Ga (1-x) N / GaN periodic structure, wherein the thickness of the GaN quantum barrier is 10nm; the second multi-quantum well layer 600 is 5 periods of In x Ga (1-x)N / GaN periodic structure, wherein the thickness of the GaN quantum barrier is 7nm; 19 cm -3 Al 0.15 Ga 0.85 N; P-type layer 800 is Mg-doped concentration 5×10 19 cm -3 GaN.
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