Formula and preparing method of thermistor insulating protection material

A technology of insulation protection and thermistor, which is applied in the direction of epoxy resin coating, coating, etc., to prevent the entry of moisture, reduce the possibility of malfunction, and improve the effect of environmental resistance

Inactive Publication Date: 2018-07-31
上海闰龙电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a formula and preparation method of the thermistor insulation protection material, which solves the shortcomings of ordinary epoxy resin coatings in the prior art, realizes convenient operation, can be automated, and can well insulate heat sensitive Resistance, to prevent the entry of moisture and reduce the technical problems of thermistor volume stretching

Method used

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  • Formula and preparing method of thermistor insulating protection material
  • Formula and preparing method of thermistor insulating protection material
  • Formula and preparing method of thermistor insulating protection material

Examples

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Effect test

Embodiment 1

[0030] This embodiment combines figure 1 with figure 2 , the material is made of the following components by mass: 100 parts of E-51 epoxy resin, 50 parts of light calcium carbonate, 10 parts of yellow paste, 20 parts of imidazole adduct curing agent, 5 parts of fumed silica, 0.05 part of defoamer.

[0031] The preparation method of this embodiment is:

[0032] 1) Weigh 100 parts of E-51 epoxy resin, 10 parts of yellow paste, and 0.05 parts of defoamer in proportion, and stir evenly;

[0033] 2) A small amount of 50 parts of light calcium carbonate was added several times, and stirred at high speed for 1.5 hours;

[0034] 3) Natural cooling to below 50°C;

[0035] 4) Add 10 parts of imidazole adduct curing agent and 5 parts of fumed silica in proportion, and stir for 10 minutes until uniform;

[0036] 5) After the three-roll machine disperses twice, stir for 10 minutes until uniform;

[0037] 6) Vacuum defoaming for 60 minutes.

[0038] Apply this insulating protection...

Embodiment 2

[0045] This embodiment combines image 3 with Figure 4 , the material is made of the following components by mass: 100 parts of liquid bisphenol F epoxy resin, 80 parts of heavy calcium carbonate, 20 parts of blue paste, 10 parts of imidazole adduct curing agent, 1 part of fumed silica part, 0.5 part of defoamer.

[0046] The preparation method of this embodiment is:

[0047] 1) Weigh 100 parts of liquid bisphenol F epoxy resin, 20 parts of blue paste, and 0.5 parts of defoamer in proportion, and stir evenly;

[0048] 2) Add 80 parts of heavy calcium carbonate several times in small amounts, and stir at high speed for 1.5 hours;

[0049] 3) Natural cooling to below 50°C;

[0050] 4) Add 10 parts of imidazole adduct curing agent and 1 part of fumed silica in proportion, and stir for 5 minutes until uniform;

[0051] 5) After the three-roll machine disperses for 3 times, stir for 20 minutes until uniform;

[0052] 6) Vacuum defoaming for 30 minutes.

[0053] Apply this i...

Embodiment 3

[0060] The material of this example is made of the following components by mass: 100 parts of liquid bisphenol F epoxy resin, 50 parts of heavy calcium carbonate, 10 parts of cyan paste, 15 parts of imidazole adduct curing agent, fumed silica 3 parts, 0.3 parts of defoamer.

[0061] The preparation method of this embodiment is:

[0062] 1) Weigh 100 parts of liquid bisphenol F epoxy resin, 10 parts of cyan paste, and 0.3 parts of defoamer in proportion, and stir evenly;

[0063] 2) Add 50 parts of heavy calcium carbonate several times in small amounts, and stir at high speed for 1.5 hours;

[0064] 3) Natural cooling to below 50°C;

[0065] 4) Add 15 parts of imidazole adduct curing agent and 3 parts of fumed silica in proportion, and stir for 5 minutes until uniform;

[0066] 5) After the three-roll machine disperses twice, stir for 20 minutes until uniform;

[0067] 6) Vacuum defoaming for 40 minutes.

[0068] Apply this insulating protection material evenly around the ...

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Abstract

The invention discloses a formula and preparing method of a thermistor insulating protection material. The material is prepared from epoxy resin, filler, color paste, a curing agent, an additive and adefoaming agent according to the weight ratio of 100:(50-80):(10-20):(10-20):(1-5):(0.05-0.5). The epoxy resin is one or two of liquid bisphenol A epoxy resin and liquid bisphenol F epoxy resin. Thefiller is one or two of light calcium carbonate and heavy calcium carbonate. The color paste is one or more of red color paste, yellow color paste, cyan color paste, black color paste and white colorpaste. The curing agent is an imidazole additive. The additive is gas-phase silicon dioxide. The defoaming agent is an organic silicon deforming agent. The material has good insulating performance, insulates a thermistor from the environment, prevents moisture from entering the thermistor, and makes the environment resistance improved; the size stretching of the thermistor is limited to a certainextent, and the resistance variation caused by the size stretching of the thermistor is reduced.

Description

technical field [0001] The invention belongs to the field of insulating and protecting materials, and in particular relates to a formulation of a thermistor insulating and protecting material and a preparation method thereof. Background technique [0002] Thermistors are a type of sensitive components. According to different temperature coefficients, they are divided into positive temperature coefficient thermistors (PTC, Positive Temperature Coefficient) and negative temperature coefficient thermistors (NTC, NegativeTemperature Coefficient). The typical characteristics of thermistors are Sensitive to temperature, showing different resistance values ​​at different temperatures. The higher the temperature of the positive temperature coefficient thermistor is, the greater the resistance value is, and the lower the resistance value of the negative temperature coefficient thermistor is when the temperature is higher, they are both semiconductor devices. [0003] Thermistors hav...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D5/25C09D7/61
Inventor 邹建平翁伟君
Owner 上海闰龙电子材料有限公司
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