A probe head structure of a cantilever type probe card

Abstract

A probe head structure of a cantilever type probe card comprises a circuit board, an adhesive layer, a plurality of probes and an insulating ceramic piece arranged successively from top to bottom. Thelower surface of the circuit board has a plurality of circuit contacts; the insulating ceramic piece has a sloped surface, and the sloped surface faces the circuit board; the probes are disposed on the sloped surface, and each probe is in contact with the corresponding circuit contact at one end; the adhesive layer is located between the insulating ceramic piece and the circuit board to fix the positions of the probes and the insulating ceramic piece. Thus, in high and low temperature test operation of wafers, the insulating ceramic piece at the bottom layer of the probe head can block heat transfer upward and guarantee that the probes are in a good contact state during the test operation, avoiding the problem of large and small wafer probe marks during the high and low temperature test process.

Description

technical field [0001] The invention relates to the technical field of a cantilever probe card, in particular to a structural improvement of a probe head to make it more suitable for wafer high and low temperature testing operations. Background technique [0002] With the development of thinner and lighter electronic products, the semiconductor manufacturing method is moving towards the direction of larger wafer diameter, higher component density and smaller circuit. The complicated process also makes it difficult to control the yield rate and the test conditions are more stringent. According to the quality requirements of integrated circuits, in addition to basic electrical tests to find products that meet the specifications, wafer high and low temperature tests will also be carried out. Various temperatures are introduced during the test. In addition to ensuring the health of the product, it can also detect For products that may fail prematurely, the dies that meet the app...

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Problems solved by technology

[0004] 1. During the high and low temperature test, the part of the probe card closest to the wafer is the resin 14. In the alternating heat and cold test, the wafer probe will be scratched due to thermal expansion and contraction (Wafer Probe Mark ) is large and small, which affects the yield of the test;

[0005] 2. Long-term exposure to the alternating hot and cold test environment will cause the resin 14 to age prematurely and crack. If it falls on the wafer, it will cause the risk of wafer damage (wafer damage)

[0006] 3. In the structure of the probe card, the fixing ring 12 is generally made of metal, which has a high coefficient of thermal expansion, and the heat source is easily transferred to this place, thereby causing the size of the fixing ring 12 to change, affecting the contact state of the probe and crystallization. The position of the scratch on the round probe will also affect the yield

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