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Glue for pouring conductive sliding ring body, conductive sliding ring body and pouring method thereof

A technology of conductive slip ring and pouring method, which is applied in the direction of application, household components, household appliances, etc., can solve the problems of low insulation resistance and withstand voltage strength, and cannot improve the insulation resistance and withstand voltage strength of conductive slip ring body, so as to achieve improvement Effects of Insulation Resistance and Dielectric Strength

Inactive Publication Date: 2018-08-07
张洁琦
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the insulation resistance and compressive strength of the conductive slip ring body are low, and the conductive glue for the conductive slip ring body cannot improve the insulation resistance and compressive strength of the conductive slip ring body, which cannot meet people's requirements

Method used

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  • Glue for pouring conductive sliding ring body, conductive sliding ring body and pouring method thereof
  • Glue for pouring conductive sliding ring body, conductive sliding ring body and pouring method thereof
  • Glue for pouring conductive sliding ring body, conductive sliding ring body and pouring method thereof

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preparation example Construction

[0034] The present invention has no special requirements on the preparation method of the casting glue for the conductive slip ring body, and the method of directly mixing the compositions well known to those skilled in the art can be used. In the present invention, there is no particular limitation on the mixing method, and a mixing method well known to those skilled in the art can be used.

[0035] The invention provides a casting method of a conductive slip ring body, comprising the following steps:

[0036] (1) Place the conductive slip ring assembly in the casting mold;

[0037] Preheat the conductive slip ring body casting glue described in the above technical solution and the casting mold with the conductive slip ring body assembly inside; fill the preheated glue into the preheated casting mold, and the The liquid level of the glue used for pouring the conductive slip ring body is controlled between 5 and 20 mm below the upper end surface of the lead port in the castin...

Embodiment 1

[0074] According to the formula ingredients, prepare 100 parts of epoxy resin E51, 8 parts of dibutyl phthalate, 10 parts of β,β'-dimethylaminoethoxy-1,3,6,2-trioxaboraoctacycline, Particle diameter is 50 parts of silicon micropowder of 5 microns, and particle diameter is 0.01 part of carbon black powder of 16 nanometers, obtains the conductive slip ring body pouring glue;

[0075] Apply D04 glue on the 10mm surface of the wire surface of the outlet slot of the ring body component to protect the wire, and cure the D04 glue at 25°C for 6 hours;

[0076] Clean the pouring mold assembly and assemble it. When assembling, ensure that the parallelism of the upper and lower pressure plates is ≤±0.2mm. After assembly, apply 704 silicone rubber to seal the gap of the pouring mold assembly to obtain the pouring mold;

[0077] Pour the glue for casting the conductive slip ring body into the beaker, stir at a constant speed with a glass rod, and heat to 80°C;

[0078] Preheat the conduct...

Embodiment 2

[0084] According to the recipe ingredients, prepare 100 parts of epoxy resin E51, 10 parts of dibutyl phthalate, 15 parts of β,β'-dimethylaminoethoxy-1,3,6,2-trioxaboroletacycline, Particle diameter is 60 parts of silicon micropowder of 5 microns, and particle diameter is 0.02 part of carbon black powder of 16 nanometers, obtains the conductive slip ring body casting glue;

[0085] Apply D04 glue on the 15mm surface of the wire surface of the outlet slot of the ring body component to protect the wire, and cure the D04 glue at 23°C for 7 hours;

[0086] Clean the pouring mold assembly and assemble it. When assembling, ensure that the parallelism of the upper and lower pressure plates is ≤±0.2mm. After assembly, apply 704 silicone rubber to seal the gap of the pouring mold assembly to obtain the pouring mold;

[0087] Pour the glue for casting the conductive slip ring body into the beaker, stir at a constant speed with a glass rod, and heat to 110°C;

[0088] Preheat the conduc...

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Abstract

The invention provides glue for pouring a conductive sliding ring body. The glue is prepared from the following components: 100 parts of epoxy resin, 8 to 10 parts of dibutyl phthalate, 10 to 15 partsof beta,beta'-dimethylaminoethoxy-1,3,6,2-trioxaborocane, 50 to 60 parts of silicon micro-powder and 0.01 to 0.02 part of carbon black powder. According to the glue for pouring the conductive slidingring body, provided by the invention, the insulating resistance and compressive strength of the conductive sliding ring body are effectively improved. The invention further provides a pouring methodof the conductive sliding ring body; the pouring method is simple to operate and has strong operability.

Description

technical field [0001] The invention relates to the technical field of conductive slip ring bodies, in particular to a glue for pouring conductive slip ring bodies and a method for pouring conductive slip ring bodies. Background technique [0002] The conductive slip ring body is a device used to transmit electric power and electrical signals. Its working principle is to realize the transmission of electrical signals and electric energy between two relative rotating mechanisms through the relative rotation of the stator part and the rotor part of the conductive slip ring body. electromechanical device. [0003] The current methods for producing slip ring bodies include casting methods and lamination methods. The lamination method is that the rings are connected with insulating washers, and they are placed on the shaft in the order of rings-insulating washers-rings-insulating washers, and the two ends are pressed tightly. The center of the shaft is hollow and used for walkin...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K5/12C08K3/36C08K3/04C08G59/40B29C35/02B29C39/42B29C39/44
CPCB29C35/02B29C39/42B29C39/44B29L2031/3406C08G59/4007C08K3/04C08K3/36C08K5/12C08K2201/003C08L63/00
Inventor 张洁琦马骥黄帅辛金栋
Owner 张洁琦
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