A kind of lithography-free preparation method of GAAS-based LED chip
A LED chip and photolithography technology, applied in the field of optoelectronics, can solve problems such as electrode damage, and achieve the effect of improving production efficiency and simplifying the process
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[0030] The invention is right figure 1 The preparation of the GaAs-based LED chip shown does not require photolithography, and the GaAs-based LED chip includes an N electrode 4 , a GaAs substrate 1 , an epitaxial layer 2 and a P electrode 3 from bottom to top.
[0031] figure 1 The preparation method of the GaAs-based LED chip includes the following specific steps.
[0032] (1) An epitaxial layer 2 is grown on a GaAs substrate 1 according to a conventional metal organic chemical vapor deposition (MOCVD) method.
[0033] (2) Prepare a patch 5 with electrode holes 6 neatly arranged (consistent intervals, periodic arrangement of LED chips prepared on demand), such as figure 2 As shown, the electrode holes 6 are prepared by conventional photolithography. The thickness of patch 5 is 80-200 μm. Paste 5 adopts common PVC material.
[0034] The electrode hole 6 is a tapered hole with a small top and a large bottom. The diameter of the electrode hole 6 (diameter of the upper end...
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