Leveling method of flexible thin film material and application of leveling method

Abstract

The invention relates to a leveling method of a flexible thin film material. The leveling method comprises the following steps of S1, cleaning a hard substrate and the flexible thin film material; S2,placing liquid-state wax on the hard substrate; S3, allowing one side of the flexible thin film material to be in contact with the liquid-state wax on the hard substrate, and leveling the flexible thin film material from one side in contact with the liquid-state wax to the other side; S4, extruding the flexible thin film material by a leveling surface to remove residual liquid-state wax; and S5,performing temperature reduction and cooling to make the liquid-state wax between the flexible thin film material and the hard substrate solidified, and smoothly fixing the flexible thin film materialon the hard substrate. The invention also relates to application of the leveling method in fabrication of a flexible electronic device. By the leveling method of the flexible thin film material, thesmoothness of a surface of the flexible thin film material can be effectively ensured, and the leveling method has the advantage of low cost, is simple to operate and can be applicable to an inorganic/organic micronano processing technology.

Description

Technical field [0001] The invention relates to the technical field of flexible electronic micro-nano processing, in particular to a flattening treatment method of flexible film materials and applications thereof. Background technique [0002] In the past 20 years, flexible electronics has received extensive attention from academia and social industries. It can be summarized as an emerging electronic technology that makes organic / inorganic material electronic devices on flexible / ductile plastic or thin metal substrates. Its flexibility / ductility and high-efficiency, low-cost manufacturing process have broad application prospects in the fields of information, energy, medical treatment, national defense and other fields. It has the characteristics of simple manufacturing process, bendable, diverse and low-cost in application production. [0003] The substrate flexibility of integrated devices is the most basic and important technical realization in flexible electronics. At present, ...

AI Technical Summary

Problems solved by technology

[0010] However, photoresist is not compatible with traditional micro-nano processing technology (silicon system) as a binder. At the same time of removal, the photoresist between the flexible film material and the hard substrate will also be removed, so that it will not be able to fix and planarize the film material

In addition, when the micro-nano electronic device needs to be removed from the hard substrate, the photoresist is removed by a glue remover (such as acetone and other organic solvents) to complete the release process. If it is to make an organic micro-nano electronic device, this This release process can cause damage to the organic functional materials on the electronic device, leading to the failure of the entire electronic device

It can be seen that although the method of photoresist adhesion can solve the flatness problem of flexible thin film materials to a certain extent, it is not completely suitable for inorganic / organic micro-nano processing technology.

Images