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Encapsulating silica gel and preparation method and application thereof

A technology of silica gel and potting, which is applied in the direction of adhesives, adhesive additives, electrical components, etc., and can solve the problems that the aesthetics needs to be further improved

Active Publication Date: 2018-08-17
深圳天鼎新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The potting silica gel prepared by the invention is a closed-cell foam material, which also has excellent impact resistance, resilience, softness, sound insulation, water resistance and vapor resistance, and its volume is not affected by the ambient temperature, and its thermal expansion coefficient is extremely high. Small, but its rheological properties and aesthetics after potting need to be further improved

Method used

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  • Encapsulating silica gel and preparation method and application thereof
  • Encapsulating silica gel and preparation method and application thereof
  • Encapsulating silica gel and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] 1) Dilute methacryloxypropyltrimethoxysilane with methyl silicone oil to form a 5% solution, then mix it with the powder in a kneader at high speed, at a temperature of 80°C, at a stirring speed of 50rpm, and stir for 30min, then Stop stirring and heating, place at room temperature for 10 hours, and then vacuumize and dry at 80° C. for 1 hour to obtain a surface-modified composite filler. The mass ratio of surface treatment additive to powder is 0.3:100. The powder is a composition of graphite powder, silicon powder and silicon micropowder with a mass ratio of 1:1:8 and a particle size of 10 μm.

[0062] 2) Heat 20 parts by weight of vinyl-terminated silicone oil, 75 parts by weight of surface-modified composite filler, and 5 parts by weight of hydrogen-containing silicone oil in a planetary mixer to 80°C, stir for 1.5 hours, vacuumize for 1 hour, and add 0.05 parts by weight part of the inhibitor, stirred for 10 minutes to obtain component A;

[0063] Heat 25 parts b...

Embodiment 2

[0066] 1) Dilute methacryloxypropyltrimethoxysilane with methyl silicone oil to form a 5% solution, then mix it with the powder in a kneader at high speed, at a temperature of 60°C, at a stirring speed of 60rpm, and stir for 25min, then Stop stirring and heating, place at room temperature for 11 hours, and then vacuumize and dry at 60° C. for 2 hours to obtain a surface-modified composite filler. The mass ratio of surface treatment additive to powder is 0.5:100. The powder is a composition of graphite powder, silicon powder and silicon micropowder with a mass ratio of 1:1:8 and a particle size of 12 μm.

[0067] 2) Heat 30 parts by weight of vinyl-terminated silicone oil, 65 parts by weight of surface-modified composite filler, and 5 parts by weight of hydrogen-containing silicone oil in a planetary mixer to 70°C, stir for 2 hours, vacuumize for 1.5 hours, and add 0.08 parts by weight part of the inhibitor, stirred for 10 minutes to obtain component A;

[0068] Heat 30 parts...

Embodiment 3

[0071] 1) Dilute methacryloxypropyltrimethoxysilane and hydroxyl-terminated polydimethylsiloxane with methyl silicone oil to form a 5% solution, and then mix them with the powder in a kneader at high speed, The temperature is 80°C, the stirring speed is 50rpm, and stirred for 30min, then the stirring and heating are stopped, and it is left at room temperature for 10 hours, and then vacuumed at 80°C for 1h to obtain a surface-modified composite filler. The mass ratio of the surface treatment auxiliary agent methacryloxypropyltrimethoxysilane and hydroxyl-terminated polydimethylsiloxane to the powder is 0.2:0.2:100. The powder is a composition of graphite powder, silicon powder and silicon micropowder with a mass ratio of 1:1:8 and a particle size of 10 μm. The viscosity of hydroxyl-terminated polydimethylsiloxane is 100cp.

[0072] 2) Heat 30 parts of vinyl-terminated silicone oil, 63 parts of surface-modified composite filler, and 7 parts of hydrogen-containing silicone oil t...

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Abstract

The invention provides an encapsulating silica gel and a preparation method and application thereof. The encapsulating silica gel is prepared from a component A and a component B, wherein the component A is prepared from the following components in parts by weight: 20 to 45 parts of vinyl silicone oil, 2 to 7 parts of hydrogen-containing silicone oil, 40 to 80 parts of surface-modified filler, and0.01 to 0.1 part of inhibitor; the component B is prepared from the following components in parts by weight: 20 to 45 parts of vinyl silicone oil, 30 to 70 parts of surface-modified filler, and 0.05to 0.2 part of catalyst. The encapsulating silica gel prepared by the preparation method has a low expansion coefficient, a good leveling property during curing, a smooth surface, and an attractive appearance, a good encapsulating effect can be kept in severe cold and hot weather environments, the components can be prevented from being cracked or damaged, and the encapsulating silica gel can be widely used in the encapsulation of electronic components such as a LED power supply and a dry type transformer, which require high temperature stability.

Description

technical field [0001] The invention belongs to the technical field of silicone rubber, relates to a potting silica gel and a preparation method thereof, in particular to a preparation method and application of a low expansion and high leveling potting silica gel. Background technique [0002] At present, in the fields of electronics, communications, and aerospace, in order to ensure that the product can work stably in an environment with large temperature changes, or be used reliably in different regions with large temperature differences, materials with low expansion coefficients are usually used to make the product obtain Excellent dimensional stability. The same requirements are also required for the silicone rubber used for potting and protecting components. Otherwise, after heating or cooling, the rubber material will expand or shrink, causing volume changes and resulting in inconsistent thermal matching with the components, not only cannot effectively prevent moisture...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/04C09J11/08H01L23/29
CPCC08K2003/023C08L2203/206C08L2205/025C09J11/04C09J11/08C09J183/04H01L23/296C08L83/04C08K9/06C08K3/04C08K3/02C08K3/36
Inventor 李培
Owner 深圳天鼎新材料有限公司
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