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Coating method of fluorescent powder

A phosphor and coating technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of unqualified products, uneven phosphors, and inability of small particle powder to settle, so as to improve quality, yield, and improve safety effect

Inactive Publication Date: 2018-08-17
GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] 3) Part of the small particle powder cannot settle, affecting the performance of LED devices
[0010] The disadvantage of the LED device using method 2) is that it is difficult to realize the LED light source with a large-scale light-emitting surface.
Because the relative direction of the centrifugal force received by different positions of the large light-emitting surface is inconsistent during rotation and centrifugation, resulting in uneven phosphor powder after centrifugation, resulting in unqualified products

Method used

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  • Coating method of fluorescent powder
  • Coating method of fluorescent powder
  • Coating method of fluorescent powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A phosphor coating method, such as image 3 As shown, after solid crystal and wire bonding, add magnetic particles 6 to the encapsulant 4 for dispensing, the phosphor powder 5 and magnetic particles 6 are randomly distributed in the encapsulant 4, and then the encapsulant 4 passes through the electromagnetic sedimentation device 7 to Make the magnetic particles 6 settle under the action of electromagnetic force; then carry out follow-up treatments such as curing.

[0036] Such as Figure 5 As shown, the magnetic particles 6 include a core 61 and a wrapping layer 62, the core 61 is made of iron, the diameter of the core 61 is 40-50nm, the wrapping layer 62 is a silicone rubber transparent wrapping layer 62, and the thickness of the wrapping layer 62 is 5 μm. -6 μm; the distribution concentration of the magnetic particles 6 in the packaging glue 4 is 0.3% of the weight of the packaging glue. The resistivity of the magnetic particles 6 is 20 Ω·m.

Embodiment 2

[0038] A phosphor coating method, such as Figure 4 As shown, dispensing is performed after solid crystal and wire bonding, and magnetic particles 6 are sprayed on the surface of the dispensed encapsulant 4, and the magnetic particles 6 are distributed on the surface of the encapsulant 4, and then the encapsulant 4 is passed through the electromagnetic sedimentation device 7 to Make the magnetic particles 6 settle under the action of electromagnetic force; then carry out follow-up treatments such as curing.

[0039] Such as Figure 5 As shown, the magnetic particle 6 includes an inner core 61 and a wrapping layer 62. The material of the inner core 61 is cobalt, and the diameter of the inner core 61 is 50-60 nm. The wrapping layer 62 is a silicone rubber transparent wrapping layer 62, and the thickness of the wrapping layer 62 is 4 μm. -5 μm; the distribution concentration of the magnetic particles 6 in the packaging glue 4 is 0.5% of the weight of the packaging glue. The res...

Embodiment 3

[0041] A phosphor coating method, such as Figure 4 As shown, after solid crystal and wire bonding, some magnetic particles 6 are added to the encapsulant 4 for dispensing, and some magnetic particles 6 are sprayed on the surface of the encapsulant 4 after dispensing, and the magnetic particles 6 are distributed on the surface and inside of the encapsulant 4 at the same time , and then make the encapsulating glue 4 pass through the electromagnetic sedimentation device 7, so that the magnetic particles 6 settle under the action of electromagnetic force; and then carry out follow-up treatments such as curing.

[0042] Such as Figure 5 As shown, the magnetic particle 6 includes a core 61 and a wrapping layer 62. The material of the core 61 is cobalt, and the diameter of the core 61 is 20-30nm. The wrapping layer 62 is a transparent wrapping layer 62 of silicon dioxide, and the thickness of the wrapping layer 62 is 6-8 μm; the distribution concentration of the magnetic particles...

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Abstract

The invention discloses a coating method of fluorescent powder. Magnetic particles are added to a packaging adhesive and electromagnetic force is applied to the packaging adhesive, wherein each magnetic particle comprises an inner core and a wrapping layer; the diameter of each inner core is 0.1nm to 10 microns; each wrapping layer is a transparent wrapping layer; and the thickness of each wrapping layer is 1-10 microns. The distribution concentration of the magnetic particles is 0.01-10% of weight of the packaging adhesive. The sedimentation rate of the fluorescent powder is increased and thesedimentation quality of the fluorescent powder is improved through adding the transparent magnetic particles acting as insulators to the inside or the external surface of the packaging adhesive containing the fluorescent powder, the quality of an LED product is improved and the yield is improved.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a fluorescent powder coating method. Background technique [0002] As a new generation of lighting solutions, LED has the advantages of energy saving, high light quality, and customizable light color, and is being used in more and more occasions. Because of this, LED applications have higher and higher performance requirements for LED light sources. The production process of LED light source is: solid crystal-wire bonding-dispensing-curing-testing-packaging, among which the technology of "dispensing" process is still being innovated, and other processes are very mature. "Dispensing" is to apply the mixture of LED phosphor and transparent silica gel to the LED bowl, so that the LED device emits light of a specific color to meet the application needs. [0003] In order to improve the reliability and light quality of LED light sources, the method of making phosphor particles...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/56
CPCH01L33/56H01L33/501H01L2933/0041H01L2933/005
Inventor 霍文旭孙婷苏佳槟
Owner GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
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