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Silver alloy powder and method for producing same

A manufacturing method and technology of alloy powder, which are used in metal/alloy conductors, cable/conductor manufacturing, metal processing equipment, etc., can solve the problems of high melting point, insufficient sintering, and inability to obtain electrical properties, and achieve low sintering temperature and sintering. Inexpensive effect of temperature

Active Publication Date: 2018-08-21
DOWA ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since the melting point of silver is as high as 961°C, when silver powder is used for a sintered conductive paste that is sintered at a relatively low temperature, the sintering may not proceed sufficiently and the desired electrical characteristics may not be obtained

Method used

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  • Silver alloy powder and method for producing same
  • Silver alloy powder and method for producing same
  • Silver alloy powder and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] 7.5 kg of silver balls (Japanese: ショット银) and 2.5 kg of tin balls (Japanese: ショット tin) were heated to 1100 ° C in a nitrogen atmosphere to melt the melt from the lower part of the casting pan, and at the same time passed through the water The atomization device sprays high-pressure water with a water pressure of 150MPa and a water volume of 160L / min in the atmosphere to make it cool and solidify rapidly, separate the solid and liquid of the obtained slurry, wash, dry, crush and classify the solid matter with water, Silver alloy powder (Ag-Sn alloy powder) was obtained. In addition, as high-pressure water, I used it at 21.6m 3 The alkaline aqueous solution (pH10.26) which added 157.55 g of caustic soda to pure water.

[0047] The BET specific surface area, tap density, oxygen content, carbon content, and particle size distribution of the silver alloy powder obtained in this way were determined, alloy composition analysis was performed, and thermomechanical analysis (TMA)...

Embodiment 2

[0057] Except using pure water (pH5.8) as high-pressure water, the amount of silver pellets and tin pellets is respectively 6.5kg and 3.5kg, obtained silver alloy powder (Ag-Sn alloy powder) by the same method as Example 1 ).

[0058] The BET specific surface area, tap density, oxygen content, carbon content, and particle size distribution of the silver alloy powder thus obtained were determined in the same manner as in Example 1, alloy composition analysis was performed, and thermomechanical analysis (TMA) was performed.

[0059] As a result, the BET specific surface area of ​​the silver alloy powder was 1.14m 2 / g, the tap density is 3.5g / cm 3 , the oxygen content is 0.57% by mass, the carbon content is 0.01% by mass, and the cumulative 10% particle size (D 10 ) is 0.8μm, cumulative 50% particle size (D 50 ) is 1.9μm, cumulative 90% particle size (D 90 ) is 4.0 μm. The Ag content in the silver alloy powder was 63% by mass, and the Sn content was 36% by mass. In additio...

Embodiment 3

[0062] Silver alloy powder (Ag—Sn alloy powder) was obtained in the same manner as in Example 1, except that the amounts of silver pellets and tin pellets were 1.35 kg and 1.65 kg, respectively.

[0063] Find the BET specific surface area, tap density, oxygen content, carbon content and particle size distribution of the silver alloy powder obtained in this way by the same method as Example 1, carry out alloy composition analysis and thermomechanical analysis (TMA), and by The same method as in Example 2 was used to measure the thickness of the oxide film on the surface.

[0064] As a result, the BET specific surface area of ​​the silver alloy powder was 1.63m 2 / g, the tap density is 3.3g / cm 3 , the oxygen content is 0.76% by mass, the carbon content is 0.01% by mass, and the cumulative 10% particle size (D 10 ) is 0.7μm, cumulative 50% particle size (D 50 ) is 1.8μm, cumulative 90% particle size (D 90 ) is 4.0 μm. The Ag content in the silver alloy powder was 45% by mass...

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Abstract

This silver alloy powder is produced by melting silver and one kind of metal selected from the group consisting of tin, zinc, lead and indium in a nitrogen atmosphere to obtain a molten metal, and then while dropping the molten metal, rapidly cooling and solidifying the molten metal by spraying high-pressure water (preferably, pure water or alkaline water) onto the molten metal in the air or in anitrogen atmosphere. The silver alloy powder is composed of silver and one kind of metal selected from the group consisting of tin, zinc, lead and indium, and has an average particle size of 0.5-20 um. During thermomechanical analysis, the temperature of the silver alloy powder is 300deg c or lower at a shrinkage rate of 0.5%, 400deg c or lower at a shrinkage rate of 1.0%, and 450deg c or lower ata shrinkage rate of 1.5%.

Description

technical field [0001] The present invention relates to a silver alloy powder and a method for producing the same, in particular, a silver alloy powder suitable for use as a material of a sintered conductive paste and a method for producing the same. Background technique [0002] Conventionally, as electrodes for solar cells, internal electrodes of electronic components using low temperature fired ceramics (LTCC) and laminated ceramic electronic components such as multilayer ceramic inductors (MLCI), external electrodes such as laminated ceramic capacitors and laminated ceramic inductors, etc. Metal powder such as silver powder is used as the material for molding the conductive paste. [0003] However, silver has a high melting point of 961° C., and when silver powder is used for a sintered conductive paste that is sintered at a relatively low temperature, sintering may not proceed sufficiently and desired electrical characteristics may not be obtained. In addition, silver ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F9/08H01B1/00H01B5/00H01B13/00C22C5/06C22C11/00C22C13/00C22C28/00B22F1/05B22F1/105
CPCC22C5/06C22C11/00C22C13/00C22C28/00H01B1/02B22F9/082C22C1/0466B22F2009/0828B22F2999/00B22F1/05B22F1/105B22F2201/02B22F2201/50H01B1/22H01B5/14B22F9/08B22F2301/255B22F2301/30B22F2301/40B22F2303/01B22F2303/15B22F2304/058B22F2304/10
Inventor 吉田昌弘道明良幸井上健一
Owner DOWA ELECTRONICS MATERIALS CO LTD