60 results about "Thermomechanical analysis" patented technology

The present invention provides a polyimide film and a manufacturing method therefor, wherein in the dimension change measurement by a thermomechanical analyzer (TMA) that performs a temperature rise procedure from 25° C. to 400° C. after storage for 48 hours at a humidity of 50% RH, the temperature-rise thermal expansion coefficient (50 to 200° C.) in the TD direction is −1.5 ppm / ° C. to 6 ppm / ° C., the temperature-rise thermal expansion coefficient (50 to 200° C.) being the slope of a straight line connecting a dimensional measurement value in the TD direction of the polyimide film as measured at 200° C. in the first run during the temperature rise procedure and a dimensional measurement value in the TD direction of the polyimide film as measured at 50° C. in the first run during the temperature rise procedure, and the dimensional measurement values in the TD direction correspond to dimensional change values calculated by converting, into 1 m, the length of a sample of the polyimide film used in the measurement by the thermomechanical analyzer.

A polarizer is provided, comprising a polyvinyl alcohol film and having an endothermic peak of 50°C to 60°C when measured by differential scanning calorimetry at a heating rate of 10°C / min; a polarizing plate comprising a polarizer and a first protective film and a second protective film respectively laminated on one surface and another surface of the polarizer, and the polarizing plate having an initial shrinkage initiation temperature greater than 70°C and less than or equal to 90°C during thermomechanical analysis; and an optical display device including the above.

Provided is an adhesive resin composition-coated electromagnetic steel sheet having a steel sheet and an adhesive resin composition coating film on at least one surface of the steel sheet, the adhesive resin composition coating film is a semi-cured product of an adhesive resin composition comprising a curing agent and an adhesive resin at least partially containing a thermosetting resin, and the adhesive resin composition coating film has a maximum penetration [lambda] at 100-300 DEG C as measured by thermomechanical analysis described in JIS K 7196: 2012 of 3% or more but less than 100%, and has a maximum penetration [lambda] at 100-300 DEG C as measured by thermomechanical analysis described in JIS K 7196: 2012, and a maximum penetration [lambda] at 100-300 DEG C as measured by thermomechanical analysis described in JIS K 7196: 2012 as measured by thermomechanical analysis described in JIS K 7196: 2012. A part of the curing agent is present in a crystalline state in the adhesive resin composition coating film, and the area ratio of the crystalline curing agent in a cross section of the adhesive resin composition coating film parallel to the surface of the steel sheet is 0.10-40%.

To provide a conductive film having excellent adhesion and optical characteristics.SOLUTION: A conductive film comprises a substrate film and a conductive layer arranged on the substrate film, wherein the substrate film comprises a resin comprising a substituent unit having a fluorene skeleton, the conductive layer comprises a conductive metal and, when the temperature of the substrate film is raised from 30°C at a rate of 10°C / min in the thermomechanical analysis under a tensile load of 30 mN in an arbitrary direction, the temperature T at which the thermal expansion displacement from the length of the substrate film at 30°C becomes 3% is 139°C or higher.SELECTED DRAWING: Figure 1

A thermomechanical analysis apparatus with improved measurement accuracy is proposed. The thermomechanical analysis apparatus (1) includes a sample stage (15) where a sample (S) is placed, a sample tube (11) where the sample stage is placed, the sample tube being fixed to a measurement system, a probe (10) extending in an axial direction (L), one end of the probe (10) coming in direct or indirect contact with the sample (S) to apply a load to the sample (S) and a furnace (12a, 12b) configured to heat the sample, wherein a contact surface of the sample stage with the sample is provided with unevenness.

The invention discloses a thermomechanical analyzer, and relates to the technical field of thermomechanical analys.The thermomechanical analyzer comprises a base, a lifting assembly, a first testing mechanism, a second testing mechanism, a clamping mechanism and a furnace body, the lifting assembly is installed on the back face of the base, the first testing mechanism is installed at the top of the lifting assembly, and the second testing mechanism is used for annular shooting of a sample; the clamping mechanism is installed at the bottom of the first testing mechanism, and the furnace body is installed in the middle of the base. The arrangement mode that the first testing mechanism, the second testing mechanism and the clamping mechanism are matched is utilized, so that the clamping mechanism can conduct point contact of different degrees according to the shapes of different samples, and the influence of the clamp on the temperature of the samples can be reduced; the sample can be subjected to mechanical pressurization testing and thermal expansion shooting comparison by the first testing mechanism and the second testing mechanism, so that the material performance of the sample can be conveniently and accurately tested, and the furnace body can conveniently perform thermal method testing on the samples with different shapes.

The thermosetting resin composition contains an epoxy resin containing an epoxy compound represented by formula (1), a curing agent, and an inorganic filler. The glass transition temperature of a thermosetting resin composition in which m is 2 and n is 2 in formula (1), measured at a heating rate of 5°C / min using thermomechanical analysis (TMA), is 190°C or more, and the die shear strength of the thermosetting resin composition to copper at 230°C, measured by the following <Procedure>, is 3.0 MPa or more. <Procedure> The thermosetting resin composition is molded using a low-pressure transfer molding machine at a mold temperature of 175° C, an injection pressure of 10 MPa, and a curing time of 120 seconds, and four 10 mm2 test pieces per level are molded on a copper lead frame. Subsequently, the die shear strength between the test piece and the copper lead frame is measured at 230°C using an automatic die shear measuring device. The die shear strength of the four test pieces is adopted.

To provide: an adhesive film having excellent heat resistance and capable of preventing peeling during a high-temperature processing step; and a method for manufacturing an electronic component using the adhesive film.SOLUTION: An adhesive film comprises an adhesive layer and a base material. In a thermomechanical analysis in which the adhesive film is held at 25°C for 10 minutes and then heated from 25°C to 350°C at a heating rate of 10°C / min while maintaining zero change in the length of the adhesive film and detecting the load as thermal shrinkage stress, a temperature at which a maximum value of the thermal shrinkage stress of the adhesive film appears is 260°C or higher, and the glass transition temperature of the adhesive layer is 0°C or higher.SELECTED DRAWING: None

This release film has a base material constituted from a biaxially oriented polypropylene film that satisfies requirements (1) and (2). Requirement (1): when the temperature is increased from 30°C to 160°C at a temperature increase rate of 10°C / min in thermomechanical analysis, the temperature at which the length of the biaxially oriented polypropylene film becomes 0.9950X0 or less is 129°C or higher. Requirement (2): the storage elastic modulus in the longitudinal direction at 23°C is 2.0 GPa or more, and the storage elastic modulus in the transverse direction at 23°C is 8.0 GPa or more.

A thermomechanical analysis apparatus with improved measurement accuracy when a sample stage is used is provided. The thermomechanical analysis apparatus (1) includes a sample stage (15) where a sample(S) is placed, a sample tube (11) where the sample stage is placed, the sample tube (11) being fixed to a measurement system, a probe (10) extending in an axial direction (L), one end of the probe coming in direct or indirect contact with the sample (S) to apply a load to the sample, and a furnace (12a, 12b) configured to heat the sample, wherein the sample stage and the sample tube respectively include engaging portions (11s, 15E) that engage with each other to position the sample stage.

The present application relates to the technical field of plate performance testing, and particularly relates to a kind of plate edge durability test method;It comprises the following steps: cutting plate sample into standard size test piece;Using thermal mechanical analyzer respectively test the linear expansion coefficient of test piece edge material and base material;The test piece after processing is placed in environmental test chamber and is subjected to cyclic test;Test piece is fixed on load testing device, and constant load is applied along the direction perpendicular to the edge interface of plate plane;Using flatness tester to measure the overall warping of test piece, compare with the warping data before testing, calculate the warping change, evaluate the actual effect of plate balanced laminating process on preventing warping after edge sealing;Using weighted scoring method to calculate the comprehensive score of edge durability;Realize that the long-term durability of plate edge sealing under complex working conditions can be comprehensively and accurately evaluated, and provide scientific and comprehensive technical support for edge sealing process optimization, material selection and structure design.

The present invention relates to a separator for an electrical storage device and a method for producing the same. The present invention provides a method for producing a separator for an electrical storage device, comprising contacting a porous body formed from a sheet-like molded body containing a silane-modified polyolefin with an alkaline solution or an acid solution, and a separator for an electrical storage device comprising a microporous membrane having a melt rupture temperature of 180°C to 220°C as measured by thermomechanical analysis (TMA).

This polypropylene film has a polypropylene-based resin as a main component, and is configured such that the value (strength X) obtained by multiplying the film thickness by the F5 value in a direction perpendicular to the principal orientation axis is 400 N / m or more and 2000 N / m or less. As measured by thermomechanical analysis (TMA), when: the thermal shrinkage (%) at 100° C. in a direction perpendicular to the principal orientation axis is SMD, 100° C.; the thermal shrinkage at 130° C. in a direction perpendicular to the principal orientation axis is SMD, 130° C.; the thermal shrinkage at 100° C. in the principal orientation axis direction is STD, 100° C.; and the thermal shrinkage at 130° C. in the principal orientation axis direction is STD, 130° C., the propropylene film satisfies |SMD, 100° C.−SMD, 130° C.|≤2.00 and |STD, 100° C.−STD, 130° C.|≤2.50.

To provide an underfill material that prevents cracking of a solder resist in reflowing, and has excellent temperature cycle resistance.SOLUTION: An underfill material contains (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler. When made into a cured product, the underfill material shows a thermal expansion coefficient of 30 ppm / °C or less, at a glass transition temperature or lower, measured by TMA (thermomechanical analysis), and shows a storage elastic modulus of 0.10 GPa or less, at 240°C, measured by DMA (dynamic mechanical analysis).SELECTED DRAWING: None

Provided is a biaxially oriented polypropylene film which has a high storage modulus and which does not substantially shrink in the width direction even during heating and at the end of heating. The biaxially oriented polypropylene film is characterized in that when the temperature is increased from 30 DEG C to 160 DEG C at a temperature increase rate of 10 DEG C / min in thermomechanical analysis, the temperature at which the length in the width direction is 0.9950 X0 or less is 129 DEG C or more with respect to the length X0 in the width direction of the biaxially oriented polypropylene film at 30 DEG C; the storage modulus of the biaxially oriented polypropylene film in the longitudinal direction at 23 DEG C is 2.0 GPa or more, and the storage modulus of the biaxially oriented polypropylene film in the width direction at 23 DEG C is 8.0 GPa or more.

A laminate having a polypropylene resin film and an inorganic oxide layer, wherein the laminate is characterized in that the water vapor transmission rate is less than 3.0 g / m2 / day, the peel strength of the inorganic oxide layer is 0.7 N / 15 mm or more, and when the stress at 121° C. in the main orientation axis direction as measured by thermomechanical analysis (TMA) is denoted by SF121° C. and the stress at 145° C. in the main orientation axis direction is denoted by SF145° C., said laminate satisfies SF145° C.−SF121° C.≤2.50 MPa. The present invention provides a laminate that is suitable for use in applications in which processing and use in a high-temperature environment are required and there is a need to reduce the effects of moisture.

The present invention provides a thermomechanical analysis apparatus with improved measurement accuracy. The thermomechanical analysis apparatus (1) comprises: a sample stage (15) on which a sample (S) is placed; a sample tube (11) on which the sample stage is placed and fixed to the measurement system; a probe (10) extending along the axial direction (L) and having one end in direct or indirect contact with the sample to apply a load to the sample; and a heating furnace (12a, 12b) for heating the sample, wherein the contact surface of the sample stage in contact with the sample is provided with a concave-convex surface (15p).

To provide a biaxially oriented polypropylene film that exhibits superior releasability and processability under high-temperature conditions, and that is suitably usable as a release film subjected to processing under high temperature.SOLUTION: A biaxially oriented polypropylene film is characterized in that a surface whose minimum autocorrelation length (Sal) is from 5 μm to 45 μm inclusive is designated as surface A, a direction in which the thermal shrinkage ratio at 150°C is maximum is designated as direction X, a direction orthogonal to the direction X in the film plane is designated as direction Y, the thermal shrinkage ratio at 150°C in the direction X is designated as Xs, the thermal shrinkage ratio at 150°C in the direction Y is designated as Ys, and a temperature at which shrinkage in the direction X reaches 0.04% is designated as XsT and a temperature at which shrinkage in the direction Y reaches 0.20% is designated as YsT in a heating process of thermomechanical analysis (TMA), wherein at least one surface is the surface A, the Xs and Ys satisfy Formula 1, XsT is in the range of 130°C to 160°C inclusive, and YsT is in the range of 140°C to 170°C inclusive. Formula 1: -10%≤Ys≤Xs≤10%.SELECTED DRAWING: None

The present invention provides a thermomechanical analysis apparatus that improves the measurement accuracy when using a sample stage. The thermomechanical analysis apparatus (1) comprises: a sample stage (15) on which a sample (S) is placed; a sample tube (11) on which the sample stage is placed and fixed to the measurement system; a probe (10) extending along the axial direction (L) and having one end in direct or indirect contact with the sample to apply a load to the sample; and a heating furnace (12a, 12b) for heating the sample, wherein engaging parts (11s, 15E) are respectively provided on the sample stage and the sample tube for positioning the sample stage by engaging with each other.

The application discloses a method for regulating the rejuvenation degree by low-temperature thermal cycle treatment, and steps of the method comprise the following: preparing a La-based amorphous alloy sample with a smooth mirror surface; performing low-temperature thermal cycle treatment on the sample, first placing the sample in liquid nitrogen (77K) and keeping the sample in the liquid nitrogen for a period of time, then quickly transferring the sample to boiling water and keeping the sample in the boiling water, and the time of the two processes is equal, and the total time is one cycle period, the time of each single cycle is controlled and the total keeping time is kept the same to obtain the sample after different cycle frequencies; analyzing the sample after the cycle by means of a nanoindenter, a differential scanning calorimeter and a dynamic thermal mechanical analyzer to obtain hardness, activation volume, relaxation enthalpy and beta relaxation activation energy respectively. The sample with different rejuvenation degrees can be obtained by regulating the cycle frequency, and the rejuvenation degree can reach the maximum at a certain cycle frequency, and the application also provides a new idea and scheme for regulating the rejuvenation degree of the amorphous alloy and improving the mechanical properties of the amorphous alloy.

A thermomechanical analysis apparatus with improved measurement accuracy is proposed. The thermomechanical analysis apparatus (1) includes a sample stage (15) where a sample (S) is placed, a sample tube (11) where the sample stage is placed, the sample tube being fixed to a measurement system, a probe (10) extending in an axial direction (L), one end of the probe (10) coming in direct or indirect contact with the sample (S) to apply a load to the sample (S) and a furnace (12a, 12b) configured to heat the sample, wherein a contact surface of the sample stage with the sample is provided with unevenness (15p).

The invention relates to the field of battery outer packing, in particular to a metal-plastic composite film for battery outer packing and a secondary battery. The metal-plastic composite film for the outer package of the battery comprises an outer base material resin layer, a middle metal layer, an inner adhesive layer and an inner hot melting resin layer which are sequentially stacked, wherein the outer base material resin layer comprises resin; a dynamic thermomechanical analysis spectrogram of the resin has a first characteristic peak in a range of 60-120 DEG C, a second characteristic peak in a range of 0-50 DEG C, and a third characteristic peak in a range of-30--90 DEG C; the peak height of the first characteristic peak is lt; 0.5, the peak height of the second characteristic peak is lt; 0.2, the peak height lt of the third characteristic peak; and 0.2 part. The outer base material resin layer with extremely high formability is obtained by designing the molecular and molecular chain motion temperature of the resin for preparing the outer base material resin layer and the ratio of the storage modulus to the loss modulus, and after the outer base material resin layer is compounded into the metal-plastic composite film, the forming capacity is remarkably improved, and the metal-plastic composite film is suitable for large-scale production. And the high forming requirement of the soft package lithium battery on the outer package material can be met.

To provide a thermomechanical analyzer with improved measurement accuracy when using a sample stage. [Solution] A thermomechanical analyzer 1 comprises a sample stage 15 on which a sample S is placed, a sample tube 11 on which the sample stage is placed and which is fixed to the measurement system, a probe 10 extending in the axial direction L with one end of itself in direct or indirect contact with the sample and applying a load to the sample, and heating furnaces 12a, 12b for heating the sample, wherein the sample stage and the sample tube are provided with engaging parts 11s, 15E, respectively, which engage with each other to position the sample stage.

The purpose of the present invention is to provide a silver powder capable of imparting excellent volume resistivity and fine line printability to a conductive paste. The present invention relates to a silver powder having a volume-based cumulative 50% diameter D50 of 0.1-1.0 μｍ as measured by a laser diffraction method, a ratio of D50 to BET diameter DBET of 1.3 or less, and a shrinkage rate of at least 1% at 200°C as measured by thermomechanical analysis.

The present invention discloses a fixture for testing a thermomechanical analyzer, which includes a base, a pressure block and two clamping blocks; the upper ends of the left and right vertical columns of the U-shaped base are arc surfaces with the same diameter; the axis of the arc surface is the front-to-back direction; the curvature of the arc surface is greater than 180°; W≤D, D is the diameter of the arc surface, and W is the left-right width at the lower ends of the left and right vertical columns; the pressure block is semi-cylindrical; 0.8S≤d≤S, d is the diameter of the semi-cylinder, and S is the minimum distance between the two arc surfaces at the upper ends of the left and right vertical columns; the two clamping blocks are used to be installed and fixed to the left and right ends of the bottom horizontal column, and the two ends of the strip sample are respectively fixed to the left and right ends of the bottom horizontal column. The present invention also discloses a thermal testing method using the fixture for testing a thermomechanical analyzer. The present invention enables the compression measuring probe and sample carrier of the thermomechanical analyzer to complete the measurement of the tension of the strip sample, thereby reducing equipment cost and replacement times, and ensuring accurate measurement results.

The utility model provides a sample preparation device based on a thermal mechanical analyzer. The sample preparation device comprises a stand column, an electric push rod, a cutting die mounting piece, a cutting die, an electric push rod switch, a sample clamping clamp and a pressing and cutting platform, a sliding rail is mounted on the cutting die mounting piece, and a cutting die with a proper size is selected to slide into the cutting die mounting piece; a drawable sample table is placed on the pressing and cutting platform with the sample preparation area, and the sample preparation area is arranged on the drawable sample table; a sample clamping clamp is arranged in the sample preparation area, and after the drawable sample table is pulled out, a sample to be tested is placed in the sample preparation area; after the electric push rod is started, the cutter die is pushed to cut a to-be-tested sample, the sample cut from the to-be-tested sample is pushed out by the rebound pad arranged in the cutter die, and the cut sample is taken out from the drawable sample table. The device is convenient to operate, and samples with corresponding shapes and sizes can be conveniently obtained.

This release film has (1) a base material and a release layer that are uniaxially stretched in the MD direction or the TD direction, and (2) the elongation in the MD direction is 250% to 3000%, and the length change rate M170 at 170°C in a tensile measurement in the MD direction according to thermomechanical analysis (TMA) is 2.0% or less.

An optimizing method for a molding process of a part made of a fiber-reinforced polymer composite is provided. A finite element method is adopted to perform thermochemical analysis of a macroscopic model of the part and thermomechanics analysis of a microscopic model of the part, so as to simulate temperature gradient, curing degree, and residual stress of the part during the molding process. A genetic algorithm is executed, with simultaneous minimization of temperature gradient, molding time, and residual stress as an optimization goal and a curing process curve as a parameter variable, to achieve the simultaneous multi-objective optimization of molding process parameters, so as to obtain an optimized molding process.

An adhesive resin composition-coated electrical steel sheet including a steel sheet, and adhesive resin composition coating on at least one surface of the steel sheet, wherein the adhesive resin composition coating is a semi-cured material of an adhesive resin composition consisting of an adhesive resin at least partly including a thermosetting resin, and a curing agent, maximum penetration λ of the adhesive resin composition coating at 100 to 300°C measured by thermomechanical analysis described in JIS K 7196:2012 is 3% or more and less than 100%, and a part of the curing agent exists in the adhesive resin composition coating in a crystalline state, and an area fraction of the curing agent in the crystalline state in a cross-section parallel to the surface of the steel sheet of the adhesive resin composition coating is 0.10 to 40%.

A silver powder is provided that can impart excellent specific resistance and fine conductivity to a conductive paste. For a silver powder, the volume-based cumulative 50% diameter D is... 50 , which is measured by a laser diffraction method, 0.1 µm or more and 1.0 µm or less; a ratio of D 50 to the BET diameter D BET 1.3 or less; and a shrinkage ratio at 200 °C in a thermomechanical analysis of 1% or more.