The invention provides an
overcurrent protection device with six plastic-packaged surfaces and a preparation method thereof, and belongs to the technical field of semiconductors, and the
overcurrent protection device comprises an
overcurrent protection
chip, the six surfaces of which are coated with
plastic packaging layers; the conductive pad
electrode is positioned on the first surface and / or the second surface of the
plastic packaging layer; a conductive pad formed on the conductive pad
electrode; and the via holes are formed at the two ends of the
plastic packaging layer and are electrically connected with the overcurrent protection
chip, the conductive bonding pad
electrode and the conductive bonding pad respectively to form a conductive loop. The beneficial effects of the invention are that the plastic
package layer completely isolates the direct contact between the internal
chip of the component and any external substance, and because of the
coating of the plastic
package layer, the expansion and aging of the core material can be greatly limited, the through-current capability of the component is improved, the lift resistance of multiple protection of the component is reduced, and the recoverable capability of the component is improved. And the
composite material has higher environment-resistant reliability and long-term charge-
discharge service life, and can be widely applied to harsh specific environments and
electronic equipment with great reliability requirements on components.