Antidamping polycrystalline silicon chip

A polycrystalline silicon wafer, anti-attenuation technology, applied in the field of solar energy, can solve the problems of easy attenuation of polycrystalline silicon wafers, irregular installation and use of polycrystalline silicon wafers, insufficient surface treatment of polycrystalline silicon wafers, etc. The effect of decay

Pending Publication Date: 2018-08-28
JIAXING NENGFA ELECTRONICS TECH CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] Nowadays, the surface treatment of polysilicon wafers is not enough, and the installation and use of polysilicon wafers are not standardized, which makes polysilicon wafers easy to decay after use. Therefore, how to design an anti-attenuation polysilicon wafer has become a problem we need to solve at present.

Method used

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  • Antidamping polycrystalline silicon chip
  • Antidamping polycrystalline silicon chip
  • Antidamping polycrystalline silicon chip

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Embodiment Construction

[0026] The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.

[0027] refer to Figure 1-Figure 4, the present embodiment is an anti-attenuation polysilicon wafer, comprising a silicon wafer main body 1, the silicon wafer main body 1 has a rectangular plate structure, and sequentially includes a tempered glass layer-11, a polyvinyl fluoride composite film 12, an N-type Silicon chip 13, conduction layer 14, P-type silicon chip 15 and tempered glass layer two 16, polyvinyl fluoride composite film 12 is fixed on the bottom surface of N-type silicon chip 13 by EVA sol, tempered glass layer one 11 is passed EVA sol Fixed on the bottom surface of polyvinyl fluoride composite film 12, toughened glass layer 2 16 is fixed on the top surface of P-type silicon chip 15 by EVA sol, the side of P-t...

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Abstract

The invention provides an antidamping polycrystalline silicon chip, belongs to the technical field of machines, and solves the problem that the performance of an existing polycrystalline silicon chipis damped. The antidamping polycrystalline silicon chip comprises a silicon chip main body, and is characterized in that the silicon chip main body is of a rectangular plate structure, and comprises afirst tempered glass layer, a polyvinyl fluoride composite membrane, an N-type silicon chip, a conducting layer, a P-type silicon chip and a second tempered glass layer from bottom to top in sequence, a protection frame is arranged on the periphery of the silicon chip main body, a junction box is arranged on one side of the protection frame, a first adapter, a second adapter, a first output electrode and a second output electrode are arranged in the junction box, a first electrode and a second electrode are vertically inserted in the protection frame in a penetrating manner. The protection frame can protect the silicon chip main body, so that bump damage is avoided, the first electrode and the second electrode can be used for auxiliary positioning, wiring is more convenient, time and labor are saved in mounting, damage of the polycrystalline silicon chip is avoided, and the damping of the polycrystalline silicon chip is reduced.

Description

technical field [0001] The invention belongs to the technical field of solar energy, and relates to a solar polycrystalline silicon wafer, in particular to an anti-attenuation polycrystalline silicon wafer. Background technique [0002] Polycrystalline silicon wafer is a form of elemental silicon. When molten elemental silicon is solidified under supercooled conditions, silicon atoms are arranged in the form of diamond lattices to form many crystal nuclei. If these crystal nuclei grow into crystal grains with different crystal plane orientations, these crystal grains combine to crystallize into polycrystalline silicon. , Polycrystalline silicon wafers are mostly used in electronics and solar power generation. They are used as raw materials for the solar energy industry chain. They are used to cast ingots or pull monocrystalline silicon rods, and then cut into silicon wafers to produce solar panels, which are solar sails on satellites and space stations. Most of them are sti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02S30/10H02S40/34
CPCH02S30/10H02S40/34Y02E10/50
Inventor 蒋春桥张树华龙文文李有
Owner JIAXING NENGFA ELECTRONICS TECH CO LTD
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