Clamping stages and machine tools for thin wafer processing

Abstract

The invention discloses a clamping carrying table for processing of thin wafers. The clamping carrying table for processing of thin wafers comprises a trough, wherein the inside of the trough is provided with magnetorheological fluid; an excitation device which is used for driving the magnetorheological fluid to be solidified or to reset to be in a fluid state is arranged on the bottom of the trough; a paper conveying mechanism is arranged on the trough, and periodically supplies single pieces of paper into the trough; the paper floats on the surface of the magnetorheological fluid; and a paper drawing mechanism is arranged on the other side, which is away from the paper conveying mechanism, of the trough. When a wafer to be processed is placed on paper, the paper drawing mechanism draws the paper so that the paper is drawn away from space between the wafer and the surface of the magnetorheological fluid. By the provided clamping carrying table for processing of thin wafers, a functional wafer can be fixed without a carrying wafer, the strength of the functional wafer is high, the breakage rate is low in a processing course, and the yield of final products is high.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a clamping platform and a machine tool for thin wafer processing. Background technique [0002] Thin wafers, especially thin wafers with a thickness less than 5mm, often need to be temporarily bonded to a carrier wafer during processing, so as to improve the strength of the functional wafer and facilitate processing, such as Thinning and grinding, etching, cutting, etc., and finally the functional wafer and the carrier wafer are separated to complete the processing of the functional wafer. [0003] It is not difficult to see that although this prior art can better solve the technical problem of weak and fragile thin wafer wafers, it additionally increases the loading wafer, which not only increases the process, reduces the production efficiency, but also increases the production efficiency of the wafer. Most of the wafers use engineering plastic boards, which are discar...

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Problems solved by technology

[0003] It is not difficult to see that although this prior art can better solve the technical problem of weak and fragile thin wafer wafers, it additionally increases the loading wafer, which not only increases the process, reduces the production efficiency, but also increases the production efficiency of the wafer. Most of the wafers use engineering plastic boards, which are discarded directly after the functional wafers are cut. Therefore, the above-mentioned carrier wafers as one-time consumables will obviously lead to an increase in processing costs, which is not conducive to the popularization of mass production.

[0004] In addition, there are carrier wafers that can be recycled multiple times in the prior art, but the functional wafers in the prior art often use cleaning agents in the process of removing bonding glue and other processes, so this type of wafer can be used multiple times. The number of times the carrier wafer can be used is also greatly limited, so there is also the problem of high processing costs

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