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High-temperature lead-free solder wire and preparation method thereof

A lead-free soldering and high-temperature technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problem of low melting point of solder wire, reduce water absorption efficiency, reduce the probability of mildew, and reduce the effect of splashing

Inactive Publication Date: 2018-09-21
昆山双达锡业制品有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing lead-free solder wires are mainly developed around the eutectic point and the nearby small fluctuation range. The melting point of the solder wires is low, but there are few high-temperature lead-free solder wires. Lead-free solder such as solder does not currently exist

Method used

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  • High-temperature lead-free solder wire and preparation method thereof

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Embodiment 1

[0039] A preparation method of high-temperature lead-free solder wire, comprising the following steps:

[0040] Step 1: Add 20Kg of silicon-copper alloy powder, 10Kg of tungsten powder, 2Kg of silver powder, 1Kg of cerium powder and 3Kg of scandium powder into the melting furnace for melting and mixing;

[0041] Step 2: Add 120Kg tin powder, 12Kg nickel powder, 2Kg indium powder, 3Kg gallium powder and 15Kg grinding wheel dust into the melting furnace of S1, melt and mix again, and add deoxidizer for deoxidation treatment;

[0042] Step 3: 14Kg rosin powder, 1Kg soldering flux, 2Kg surfactant, 0.2Kg film forming agent and 0.5Kg benzotriazole are added in the agitator and stirred, then transferred to the smelting furnace of step 2 and mixed to obtain semi-finished products;

[0043] Step 4: Cast the semi-finished product into a mold to form it, use a lathe to remove the oxidized surface of the semi-finished product, and then use strong acid to pickle the semi-finished product;...

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Abstract

The invention discloses a high-temperature lead-free solder wire and relates to the field of production of solder wires. The high-temperature lead-free solder wire is primarily prepared from the following components in parts by mass: 120-180 parts of tin powder, 20-30 parts of silicon-copper alloy powder, 12-16 parts of nickel powder, 10-12 parts of tungsten powder, 2-3 parts of silver powder, 3-5parts of scandium powder, 14-18 parts of rosin powder, 1-3 parts of scaling powder, 2-5 parts of a surfactant, 0.2-2 parts of a film-forming agent, 0.5-1.0 part of benzotriazole, 15-20 parts of grinding wheel ash, 2-4 pars of indium powder, 1-3 parts of cerium powder, 3-5 parts of gallium powder and 20-30 parts of shell powder. The relatively high melting point can be guaranteed while lead is notadded, so that the environmental pollution is reduced favorably. Meanwhile, the high-temperature lead-free solder wire is relatively simple in preparation method and suitable for being produced on alarge scale.

Description

technical field [0001] The invention relates to the field of solder material production, in particular to a high-temperature lead-free solder wire and a preparation method thereof. Background technique [0002] Solder wire is a kind of alloy solder. Usually, solder wire is used as solder when soldering with an electric soldering iron. For the convenience of the user, it is usually set as a "wire" roll of different thickness, and the user can pull it out when using it, and use it with an electric soldering iron. Solder wire secures electronic components to circuit boards. When it is heated to a certain temperature, it will be melted, so that the soldered components and the circuit board are connected together, and after cooling down from the melting point, it will solidify to form a fixed solder joint. [0003] However, most of the existing solder wire materials are lead solder wires. If various electronic products made of lead solder wire are discarded or in the process of...

Claims

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Application Information

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IPC IPC(8): B23K35/22B23K35/26B23K35/14B23K35/40
CPCB23K35/22B23K35/0227B23K35/26B23K35/40
Inventor 郭斌
Owner 昆山双达锡业制品有限公司
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