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A new type of inorganic insulation board prepared by foaming perlite powder at room temperature and its preparation method

A technology of inorganic thermal insulation board and perlite powder, which is applied in the field of building exterior wall thermal insulation materials, can solve the problems of low thermal conductivity, high thermal conductivity, low compressive strength, etc., and achieves good thermal insulation performance, high mechanical strength, and water resistance. Excellent effect

Active Publication Date: 2021-08-17
CHINA UNIV OF GEOSCIENCES (BEIJING)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, currently commercially available inorganic thermal insulation materials generally have defects such as high thermal conductivity, low compressive strength, high water absorption, and poor durability.
The traditional expanded perlite insulation board uses expanded perlite particles as the main raw material. Although it has the characteristics of small thermal conductivity and high temperature resistance, the production process of expanded perlite needs to be heated to about 1300°C to make it expand at high temperature. The process consumes a lot of energy
At the same time, in the process of mining and production of perlite, a large amount of discarded fine tailings are produced, resulting in a serious waste of resources

Method used

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  • A new type of inorganic insulation board prepared by foaming perlite powder at room temperature and its preparation method
  • A new type of inorganic insulation board prepared by foaming perlite powder at room temperature and its preparation method
  • A new type of inorganic insulation board prepared by foaming perlite powder at room temperature and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] Mix 50 parts of perlite powder or its tailings powder, 0.6 part of sodium dodecylsulfonate, and 0.8 part of silicone hydrophobic powder, and then add 42 parts of water glass with a modulus of 3.2 and 4 parts of hydrogen peroxide, and mix well. get mixed material;

[0097] The obtained mixed material is poured in the mould, straightened out, covered with a perforated lid and foamed for 24 hours;

[0098] Place the foamed product in a constant temperature oven, dry at 60°C for 24 hours, demould after drying, place the stripped plate in a muffle furnace, and sinter at 500°C for 30 minutes;

[0099] The sintered board is placed in an organic silicon solution immersed in organic silicon / water=1 / 60 for 10 minutes, and finally the dipped board is dried in a constant temperature drying oven at 60°C to obtain the final product.

[0100] Each performance index of this sample is as follows: density=150kg / m 3 , Compressive strength = 0.56MPa, thermal conductivity = 0.054W / (m·K), ...

Embodiment 2

[0102]Mix 50 parts of perlite powder or its tailings powder, 0.6 parts of sodium dodecylsulfonate, and 0.8 parts of silicone hydrophobic powder, then add 42 parts of water glass with a modulus of 1.2 and 4 parts of hydrogen peroxide, and mix and stir evenly , to get the mixed material;

[0103] The obtained mixed material is poured in the mould, straightened out, covered with a perforated lid and foamed for 24 hours;

[0104] Place the foamed product in a constant temperature oven, dry at 60°C for 24 hours, demould after drying, place the stripped plate in a muffle furnace, and sinter at 500°C for 30 minutes;

[0105] Put the sintered plate into the organosilicon solution immersed in organic silicon / water=1 / 60 for 10 minutes, and finally dry the impregnated plate in a constant temperature drying oven at 60°C.

[0106] Each performance index of this sample is as follows: density=170kg / m 3 , compressive strength = 0.7MPa, thermal conductivity = 0.052W / (m·K), volumetric water a...

Embodiment 3

[0108] 50 parts of perlite powder or its tailings powder, 42 parts of modulus are water glass of 3.2 molds, 0.2 part of CTAB, 4 parts of rock wool are mixed; add 4 parts of hydrogen peroxide and mix and stir again, obtain mixed material;

[0109] The obtained mixed material is poured in the mould, straightened out, covered with a perforated lid and foamed for 24 hours;

[0110] Place the foamed product in a constant temperature oven, dry at 60°C for 24 hours, demould after drying, place the stripped plate in a muffle furnace, and sinter at 500°C for 30 minutes;

[0111] The sintered board is placed in an organic silicon solution immersed in organic silicon / water=1 / 60 for 10 minutes, and finally the dipped board is dried in a constant temperature drying oven at 60°C to obtain the final product.

[0112] Each performance index of this sample is as follows: density=180kg / m 3 , compressive strength = 0.45MPa, thermal conductivity = 0.050W / (m·K), volumetric water absorption = 2%, ...

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Abstract

The invention discloses a novel inorganic heat preservation board prepared by foaming perlite powder at normal temperature and a preparation method thereof. , foaming agent, water-repellent powder and inorganic fiber, and adopt the method of room temperature foaming to prepare a new type of inorganic insulation board. The prepared insulation board has low thermal conductivity, high compressive strength, low water absorption, good fire resistance and durability, The method for preparing the foamed perlite inorganic thermal insulation board has simple process, mild preparation conditions, energy saving and environmental protection, waste perlite tailings powder can also be used, resources are saved, and it is suitable for large-scale industrial production.

Description

technical field [0001] The invention relates to the technical field of thermal insulation materials for building exterior walls, in particular to a thermal insulation board prepared by foaming perlite powder at room temperature and a preparation method thereof, and at the same time proposes a method for efficiently utilizing perlite tailings. Background technique [0002] Building energy consumption accounts for a large proportion of the total energy consumption of the whole society, and energy consumption such as heating and cooling accounts for the vast majority during the use of buildings, mainly caused by excessive heat exchange of external walls. In the development of green and energy-saving construction in my country, the most important means is to install thermal insulation systems on buildings. The insulation system is mainly composed of insulation materials, which mainly include organic and inorganic insulation materials. [0003] At present, the commercially avail...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B38/02C04B35/16C04B35/622C04B35/632C04B35/63C04B41/84
CPCC04B35/16C04B35/622C04B35/62204C04B35/6316C04B35/632C04B38/02C04B41/4905C04B41/84C04B2235/449C04B2235/77C04B2235/96C04B2235/9607C04B38/0067C04B41/4535
Inventor 廖立兵高欢刘昊梅乐夫吕国诚
Owner CHINA UNIV OF GEOSCIENCES (BEIJING)
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