Plastic package method and package body prepared by same

Abstract

The invention provides a plastic package method and a package body prepared by the same. The plastic package method includes the following steps that: a product to be packaged comprises a carrier, wherein the carrier is provided with at least one chip, wherein the chips are connected with the carrier; a plastic package mold is provided, a plastic package groove is formed in the plastic package mold, a jig is provided, the shape of the jig is the same as the shape of the plastic package groove, the jig covers the inner surface of the plastic package groove, and a metal thin sheet is formed on the inner surface of the jig; a plastic package material is arranged, the product to be packaged is buckled to the plastic package groove, and a surface of the product to be packaged, which is providedwith the chips, face the interior of the plastic package groove; and plastic package is carried out, the plastic package material forms the plastic package body and covers the chips, so that the package body can be formed; and the plastic package mold is removed, and the jig is removed with the plastic package mold, and the metal thin sheet covers the surface of the plastic package body. With theplastic package method adopted, technique procedures can be decreased, and costs can be saved; and the metal thin sheet not only plays a role of electromagnetic shielding, but also can be used as a conductive layer; the metal thin sheet has a heat dissipation sheet function; and a metal pattern can be formed on the metal thin sheet.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a plastic packaging method and a packaging body prepared by the plastic packaging method. Background technique [0002] With the development of electronic products, semiconductor technology has been widely used in the manufacture of memory, central processing unit (CPU), liquid crystal display device (LCD), light emitting diode (LED), laser diode and other devices or chipsets. Since electronic components such as semiconductor components, micro-electromechanical components (MEMS) or optoelectronic components have tiny and fine circuits and structures, in order to avoid dust, acid and alkali substances, moisture and oxygen from polluting or corroding electronic components, thereby affecting their reliability and In terms of lifespan, packaging technology needs to be used to provide the above-mentioned electronic components with functions such as power distribution, signal dis...

AI Technical Summary

Problems solved by technology

The way to form the conductive layer of the existing package is complicated, such as forming the conductive layer by ion sputtering process, which will increase the manufacturing process, prolong the production time of the product, and is not conducive to cost saving

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