Lightweight high-strength inorganic shaving board and preparation method thereof
A particleboard and high-strength technology, which is applied in the field of light-weight and high-strength inorganic particleboard and its preparation, can solve the problems affecting the strength of the board, the viscosity of the inorganic adhesive is high, and the weight is large, so as to improve the uniformity of application, high mechanical strength of the board, and mechanical strength. The effect of increasing strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0031] A light-weight high-strength inorganic particle board of the present invention is composed of wood shavings, inorganic adhesives and sponge particles; the weight ratio of the wood particles, inorganic adhesives and sponge particles is 50:100:1; the aperture of the sponge particles is 150 nm, a porosity of 92%, and a particle size of 1 mesh; the inorganic adhesive is magnesium oxychloride cement whose viscosity is adjusted to 200-300 centipoise.
[0032] The preparation method of described lightweight high-strength inorganic particle board, comprises the steps:
[0033] (1) Selecting a block sponge with a pore diameter of 150nm and a porosity of 92%, is pulverized into 1 purpose sponge particles by a pulverizer;
[0034] (2) The sponge particles are sent into the vacuum mixer, the inorganic adhesive is sprayed into the surface of the sponge particles in the vacuum mixer by the screw pump, and the mixer is started simultaneously to carry out a normal pressure mechanical s...
Embodiment 2
[0040]A light-weight high-strength inorganic particleboard of the present invention is composed of wheat straw shavings (non-wood shavings), inorganic adhesives and sponge particles; the weight ratio of the wheat straw particles, inorganic adhesives and sponge particles is 60:120:1.5; the The pore diameter of the sponge particles is 300nm, the porosity is 95%, and the particle size is 4 meshes; the inorganic adhesive is sulfoaluminate cement whose viscosity is adjusted to 200-300 centipoise.
[0041] The preparation method of described lightweight high-strength inorganic particle board, comprises the steps:
[0042] (1) choose the massive sponge that aperture is 300nm, porosity 95%, be pulverized into 4 purpose sponge particles by pulverizer;
[0043] (2) The sponge particles are sent into the vacuum mixer, the inorganic adhesive is sprayed into the surface of the sponge particles in the vacuum mixer by the screw pump, and the mixer is started simultaneously to carry out a nor...
Embodiment 3
[0049] A light-weight high-strength inorganic particle board of the present invention is composed of bamboo shavings (non-wood shavings), inorganic adhesives and sponge particles; the weight ratio of the bamboo particles, inorganic adhesives and sponge particles is 55:110:2; the The pore diameter of the sponge particles is 200nm, the porosity is 92%, and the particle size is 2 meshes; the inorganic adhesive is portland cement whose viscosity is adjusted to 200-300 centipoise.
[0050] The preparation method of described lightweight high-strength inorganic particle board, comprises the steps:
[0051] (1) choose the massive sponge that aperture is 200nm, porosity 92%, be pulverized into 2 purpose sponge particles by pulverizer;
[0052] (2) The sponge particles are sent into the vacuum mixer, the inorganic adhesive is sprayed into the surface of the sponge particles in the vacuum mixer by the screw pump, and the mixer is started simultaneously to carry out a normal pressure mec...
PUM
Property | Measurement | Unit |
---|---|---|
pore size | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
density | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com