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Two-component quick-drying glue and preparation method thereof

A two-component, dry glue technology, used in adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve toughness, poor high temperature and high humidity resistance, poor adhesion to plastic substrates, epoxy resin The problem of slow curing of glue, etc., to achieve the effect of good toughness

Inactive Publication Date: 2018-10-12
烟台长盈电子科技有限公司
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AI Technical Summary

Problems solved by technology

[0002] In industrial structural bonding, cyanoacrylate quick-drying adhesives are widely used due to their fast curing characteristics, but due to their poor toughness and high temperature and high humidity resistance after curing, cyanoacrylate quick-drying The application is limited; although epoxy glue can solve the shortcomings of cyanoacrylate quick-drying glue toughness, high temperature and high humidity resistance, but the curing of epoxy glue is slow, which affects production efficiency, and epoxy glue is not suitable for many Poor adhesion to plastic substrates

Method used

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  • Two-component quick-drying glue and preparation method thereof
  • Two-component quick-drying glue and preparation method thereof
  • Two-component quick-drying glue and preparation method thereof

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Embodiment 1

[0014] A two-component quick-drying adhesive, wherein the mass ratio of components A and B is 1:1;

[0015] Component A: 79Kg of ethyl α-cyanoacrylate, 1Kg of ethyl α-cyanoacrylate solution containing 1000ppm boron trifluoride, 0.05Kg of 85% phosphoric acid, 0.95Kg of lithium tetrafluoroborate, VINNOL H40 from Wacker Germany / 60 vinyl resin 19Kg;

[0016] Component B: 54Kg of bis((3,4-epoxycyclohexyl)methyl) adipate (2127--03-9, Syna Epoxy28), 26Kg of epoxidized hydroxyl-terminated polybutadiene (Poly BD 600E), 0.3Kg of 2,2'-dithiodipyridine (2127--03-9, DPDS), 15.7Kg of American Chemura ABS high rubber powder Blendex 338; 4.0Kg of Cabot gas phase dioxide Silicon (CAB-O-SIL TS720).

[0017] Concrete, the preparation method of the α-cyanoacrylate ethyl ester solution containing 1000ppm boron trifluoride as stabilizer: pass boron trifluoride gas to α-cyanoacrylate ethyl ester, the liquid mass increase amount is exactly the amount of boron trifluoride The dissolved amount, unt...

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Abstract

The invention relates to two-component quick-drying glue and a preparation method thereof. The two-component quick-drying gel comprises a component A and a component B. The component A comprises ethylalpha-cyanoacrylate, an ethyl alpha-cyanoacrylate solution containing 1000 ppm of boron trifluoride, phosphoric acid with a concentration of 85%, lithium tetrafluoroborate and vinyl chloride-vinyl acetate resin. The component B comprises an epoxy resin, a toughening agent, an accelerator, ABS high rubber powder and fumed silica. The two-component quick-drying glue realizes rapid curing at the room temperature and has good toughness and impact resistance. The two-component quick-drying glue is suitable for bonding metals and most of plastic and rubber, has adhesion to plastic than that of epoxy glue and toughness and high temperature resistance better than those of the cyanoacrylate and is suitable for a high temperature and high humidity environment.

Description

technical field [0001] The invention relates to a two-component quick-drying adhesive and a preparation method thereof, belonging to the field of adhesives. Background technique [0002] In industrial structural bonding, cyanoacrylate quick-drying adhesives are widely used due to their fast curing characteristics, but due to their poor toughness and high temperature and high humidity resistance after curing, cyanoacrylate quick-drying The application is limited; although epoxy glue can solve the shortcomings of cyanoacrylate quick-drying glue toughness, high temperature and high humidity resistance, but the curing of epoxy glue is slow, which affects production efficiency, and epoxy glue is not suitable for many Adhesion to plastic substrates is poor. Therefore, the market is in urgent need of an adhesive that can quickly cure, has good toughness, high temperature and high humidity resistance, and is suitable for bonding various substrates such as metal, plastic, and rubber...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/04C09J4/06C09J11/04C09J11/06
CPCC09J4/06C09J11/04C09J11/06
Inventor 杜光清
Owner 烟台长盈电子科技有限公司
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