PCB underwater wire repairing device

An equipment and wire repair technology, applied in the field of PCB underwater repair wire equipment, can solve the problems of increasing the difficulty of repairing wires, peeling of copper foil and insulating substrate, limited connection strength between copper foil and insulating substrate, etc., to achieve good heat conduction and heat dissipation. , cost saving, and the effect of improving repair efficiency

Pending Publication Date: 2018-10-16
GUANGZHOU MICRO WELDING EQUIP
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AI Technical Summary

Problems solved by technology

Due to the thinness of the printed circuit, the connection strength between the copper foil and the insulating substrate is limited. If the traditional resistance welding parallel electrode is used for repair, it is easy to peel off the copper foil of the printed circuit and the insulating substrate due to excessive output energy.
In addition, the traditional parallel electrodes require the printed circuit to do secondary spot welding at both ends of the fracture, which increases the difficulty of supplementary wires

Method used

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  • PCB underwater wire repairing device
  • PCB underwater wire repairing device
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Embodiment Construction

[0014] In order to make the purpose, technical solution and technical effect of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementations described in this specification are only for explaining the present invention, not for limiting the present invention.

[0015] Please refer to figure 1 As shown, it is a structural schematic diagram of the PCB underwater patching equipment of the present invention, which includes a workbench 101, a head support 102, a spot welding head 103, a workpiece water tray 104 for placing a PCB, and a resistance welding welding power supply 105, wherein, The spot welding head 103 is installed on the head support 102, the workpiece water tray 104 is placed on the workbench 101 below the spot welding head 103, and the resistance welding welding power supply 105 is connected to ...

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Abstract

The invention relates to the field of electronic industry printed circuit board manufacturing and resistance welding. The PCB underwater wire repairing device of the invention includes a workbench anda spot welder head arranged on the workbench and connected to a welding power source through an output cable, wherein the workbench is provided with a workpiece water tray used for placing a PCB, andthe workpiece water tray is located below the spot welder head. Compared to the prior art, according to the invention, the PCB is immersed by adding water into the workpiece water tray, a copper foilcircuit of the PCB is repaired through parallel electrodes underwater so that a copper foil of a printed circuit is prevented from being stripped from an insulating substrate. In addition, the PCB underwater wire repairing device of the present invention is provided with a parallel electrode welding head integrated with a flat-type welding head tip, which not only achieves the repair of an interrupted printed circuit by spot welding only once, but also replaces an expensive wire supplementing belt in the prior art with enameled wires, which reduces the cost. In addition, the wire-repairing process can be effectively simplified and the wire-repairing efficiency can be improved.

Description

technical field [0001] The invention belongs to the fields of printed circuit board production and resistance welding in the electronics industry, and more specifically, the invention relates to a PCB underwater line patching device. Background technique [0002] Printed circuit boards are also called PCBs, including 600*500mm (length*width) hard boards and 400*250mm (length*width) soft boards. When making a printed circuit, if the printed circuit is interrupted or damaged, it must be repaired with a patch tape. Since the printed circuit is very thin, the connection strength between the copper foil and the insulating substrate is limited. If the traditional resistance welding parallel electrode is used for repair, it is easy to peel off the copper foil of the printed circuit and the insulating substrate due to excessive output energy. In addition, the traditional parallel electrodes require the printed circuit to do secondary spot welding at both ends of the fracture, which...

Claims

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Application Information

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IPC IPC(8): H05K3/24B23K11/00
CPCH05K3/24B23K11/002H05K2203/0195
Inventor 杨仕桐
Owner GUANGZHOU MICRO WELDING EQUIP
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