Unlock instant, AI-driven research and patent intelligence for your innovation.

A light-emitting diode chip and its manufacturing method

A technology of light-emitting diodes and manufacturing methods, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting the service life of light-emitting diode chips, low light-emitting efficiency of light-emitting diode chips, and rising temperature, so as to improve light-emitting efficiency and reduce refraction rate difference, the effect of avoiding temperature rise

Active Publication Date: 2020-12-08
HC SEMITEK ZHEJIANG CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The refractive index of silicon dioxide is 1.44, and the refractive index of indium tin oxide is 2.05. When the light emitted by the active layer enters the passivation protective layer from the transparent conductive layer, the refractive index changes greatly, and the reflectivity is relatively large. Many photons will be reflected in the light emitted by the layer, and most of the reflected photons will be lost in the transmission path, resulting in low light extraction efficiency of the LED chip, and at the same time, photons will be lost in the transmission path. Heat, the heat generated causes the temperature of the light-emitting diode chip to rise, which affects the service life of the light-emitting diode chip

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A light-emitting diode chip and its manufacturing method
  • A light-emitting diode chip and its manufacturing method
  • A light-emitting diode chip and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0046] An embodiment of the present invention provides a light emitting diode chip, figure 1 For the structural schematic diagram of the light-emitting diode chip provided by the embodiment of the present invention, see figure 1 , the LED chip includes a substrate 10 , an N-type semiconductor layer 21 , an active layer 22 , a P-type semiconductor layer 23 , a transparent conductive layer 30 , a P-type electrode 41 , an N-type electrode 42 and a passivation protection layer 50 . The N-type semiconductor layer 21, the active layer 22, and the P-type semiconductor layer 23 are sequentially stacked on the substrate 10, the P-type semiconductor layer 23 is provided with a groove 20 extending to the N-type semiconductor layer 21, the transpa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a light-emitting diode chip and a manufacturing method thereof, and belongs to the technical field of semiconductors. The chip includes a substrate, an N-type semiconductor layer, an active layer, a P-type semiconductor layer, a transparent conductive layer, a P-type electrode, an N-type electrode, and a passivation protective layer; the passivation protective layer includes a first sub layer and a second sub layer which are sequentially stacked; the first sub layer is made of silicon oxynitride, the content of the oxygen component in the first sub layer gradually increases in the stacking direction of the passivation protective layer, and the content of the nitrogen component in the first sub layer gradually decreases in the stacking direction of the passivation protective layer; and the second sub layer is made of silicon dioxide. The invention can effectively avoid the sharp change of the refractive index when the light emitted from the active layer is directly incident from a transparent conductive layer to a silicon dioxide layer, can reduce the number of photons reflected in the light emitted by the active layer, can reduce the number of photons lost in a transmission path, and can improve the light-emitting efficiency of the light-emitting diode chip.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a light emitting diode chip and a manufacturing method thereof. Background technique [0002] A light-emitting diode (English: Light Emitting Diode, referred to as: LED) is a semiconductor electronic component that can emit light. As a high-efficiency, environmentally friendly and green new-generation solid-state lighting source, LED has the advantages of low voltage, low power consumption, small size, light weight, long life, and high reliability. Since the gallium nitride (GaN)-based LED was successfully developed by Japanese scientists in the 1990s, the process technology of LED has continued to improve, and the luminous brightness has continued to increase. It is being rapidly and widely used in traffic lights, automotive interior and exterior lights, urban landscape lighting, Mobile phone backlight, outdoor full-color display and other fields. [0003] The existing ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/44H01L33/00
CPCH01L33/005H01L33/44
Inventor 兰叶顾小云
Owner HC SEMITEK ZHEJIANG CO LTD