Vacuum plating sterilization film

A technology of vacuum plating and sterilization layer, applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of low efficiency, strong dependence, side effects of organic sterilization materials, etc., and achieve a wide range of sterilization, The sterilization speed is fast and the effect of increasing the sterilization range

Active Publication Date: 2018-10-23
肇庆市双石金属实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned bactericidal materials have certain defects, such as the low efficiency of silver and copper bactericidal materials, and the photocatalytic

Method used

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  • Vacuum plating sterilization film

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] Example 1

[0026] Such as figure 1 As shown, the manufacturing method of vacuum plating sterilization film includes the following steps: using ion plating method to deposit Ti on a stainless steel substrate as a spacer layer, the thickness of the spacer layer is 0.1μm, and then using the method of magnetron sputtering BiCuSe 3 It is deposited on the spacer layer as a sterilization layer. The thickness of the sterilization layer is 20 nm. Finally, Al is deposited on the sterilization layer as a protective layer by magnetron sputtering, and the thickness of the protective layer is 0.1 μm.

[0027] Preparation of spacer layer: using ion plating method, Ti film is deposited by multi-arc ion plating, the sample starts to deposit Ti after Ar ion sputtering cleaning in the coating chamber for 5 minutes, the target material is titanium dioxide target, the purity is 99.99%, the target chamber is vacuum Degree 3.2×10 -1 Pa. Coating process parameter is N 2 Flow 3.2×10 -5 m 3 min -1 ...

Example Embodiment

[0034] Example 2

[0035] Such as figure 1 As shown, the manufacturing method of the vacuum plating sterilization film includes the following steps: Ni is deposited on the aluminum alloy substrate by ion plating as a spacer layer, the thickness of the spacer layer is 0.5μm, and then the BiAgSe is deposited by magnetron sputtering. 3 It is deposited on the spacer layer as a sterilization layer. The thickness of the sterilization layer is 200 nm. Finally, Ni is deposited on the sterilization layer as a protective layer by magnetron sputtering, and the thickness of the protective layer is 0.5 μm.

[0036] Preparation of sterilization layer: BiAgSe 3 Prepared by magnetron sputtering, the target material for magnetron sputtering is BiAgSe 3 , The purity is 99.99%. In the experiment, Ar gas was used as the sputtering gas, and an appropriate amount of oxygen was introduced, and the sputtering was performed after the current and voltage were sufficiently stabilized. The working pressure d...

Example Embodiment

[0042] Example 3

[0043] Such as figure 1 As shown, the manufacturing method of vacuum plating sterilization film includes the following steps: using ion plating method to deposit Al on the copper substrate as a spacer layer, the thickness of the spacer layer is 1μm, and then using magnetron sputtering method to BiAgSe 3 It is deposited on the spacer layer as a sterilization layer, the thickness of the sterilization layer is 500 nm, and finally Ti is deposited on the sterilization layer as a protective layer by magnetron sputtering, and the thickness of the protective layer is 1 μm.

[0044] Preparation of sterilization layer: BiAgSe 3 Prepared by magnetron sputtering, the target material for magnetron sputtering is BiAgSe 3 , The purity is 99.99%. In the experiment, Ar gas was used as the sputtering gas, and an appropriate amount of oxygen was introduced, and the sputtering was performed after the current and voltage were sufficiently stabilized. The working pressure during sput...

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Abstract

The invention discloses a vacuum plating sterilization film. The vacuum plating sterilization film comprises a metal base, at least one interval sterilization layer and a protecting layer which are connected in sequence, wherein the interval sterilization layer comprises an interval layer and a sterilization layer connected to the interval layer; the outer side of the interval layer is connected to the base; the outer side of the sterilization layer is connected to the protecting layer; and material of the sterilization layer is BiXSe3, wherein X is Cu or Ag. The BiXSe3 is used as the materialof the sterilization layer of the sterilization film, wherein Bi is a pentavalent positive ion, has relatively strong oxidizability, can oxidize common bacteria and achieves a sterilization effect; an X ion uses the charge synergistic effect of an S1 electron orbit of the outer layer of the X ion and a 6S26P3 orbit of the Bi to greatly improve the sterilization rate and sterilization range of theBi ion, and thus, the vacuum plating sterilization film has the advantages of fast sterilization speed, wide sterilization range and no side effects.

Description

Technical field: [0001] The invention belongs to the technical field of functional film materials, and in particular relates to a vacuum-plated bactericidal film. Background technique: [0002] With the continuous improvement of the quality of human life, human beings have higher expectations for their own quality of life and environmental conditions, so some new products and materials with antibacterial and sterilizing properties have begun to enter the field of vision of human beings. Usually, what we refer to as antibacterial materials is to add antibacterial agents to materials or products to make them produce antibacterial properties, kill bacteria on materials within a certain period of time, and inhibit their growth and reproduction. [0003] There are many kinds of bactericidal materials, the most traditional ones are silver and copper bactericidal materials. In addition, bactericidal materials such as titanium dioxide and zinc oxide with photocatalytic activity are ...

Claims

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Application Information

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IPC IPC(8): C23C14/06C23C14/16C23C14/18C23C14/32C23C14/35A61L2/232
CPCA61L2/232C23C14/0623C23C14/16C23C14/18C23C14/185C23C14/325C23C14/35
Inventor 朱常锦朱元义
Owner 肇庆市双石金属实业有限公司
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