Temperature increasing and decreasing adjustment instrument based on semiconductor refrigeration and heating technology

A technology of lifting adjustment, cooling and heating, applied in refrigerators, refrigeration and liquefaction, machines using electric/magnetic effects, etc., can solve problems such as long expansion time, difficult production capacity expansion, and slow heating/cooling speed , to achieve the effect of high temperature maintenance stability, easy promotion and application, and fast temperature rise and fall

Pending Publication Date: 2018-10-30
胡晓
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Both of the aforementioned two types of equipment have the following disadvantages: (1) they are bulky and heavy, and are difficult to move flexibly. Generally, the compressors commonly used in manufacturing are larger than 80cm*100cm*120cm in size and weigh more than 50kg; (2) the investment cost is high, and a The market price of a compressor ranges from 100,000 to 800,000 RMB, and the market price of each compressor and heat flow meter commonly used in industrial-grade product manufacturing or experiments is about 200,000 RMB; (3) The heating / cooling speed is very slow Under normal circumstances, it takes about 20 minutes for the compressor to cool down from normal temperature 25 degrees Celsius to -40 degrees Celsius, then rise from -40 degrees Celsius to 85 degrees Celsius, and then return from 85 degrees Celsius to normal temperature 25 degrees Celsius. And during the preheating process, heat accumulation will have a great impact on the stability of the temperature of electronic products; (4) The accuracy of the temperature stabilization time is not high. In general, at the temperature of -40 degrees Celsius and 85 degrees Celsius, the temperature accuracy Not high, fluctuating temperature above 3 degrees Celsius; (5) It is difficult for enterprises to expand production in the middle and late stages. Due to the defects of (1) to (4) mentioned above in the existing equipment, subsequent expansion needs to re-arrange the production workshop, resulting in huge losses. and it takes a long time to plan
Therefore, the application of equipment provided in the existing high and low temperature environment has brought many difficulties to many optical communication and electronic product manufacturing companies in the process of rapid investment, growth, and replacement.
In addition, these two types of equipment also have serious problems of noise pollution and exhaust pollution.
[0004] With the gradual expansion of the scale of the enterprise, if the existing general-purpose compressor equipment or heat flow meter equipment is still used to provide high and low temperature environment for production activities, it will make it difficult to expand production capacity, causing significant waste and inconvenience to the rewiring layout of the production line. Loss, long expansion time and many other problems have been unable to meet the needs of optical communication product manufacturers, and there is an urgent need to develop a more integrated, miniaturized, portable, small investment and highly flexible temperature rise and fall adjustment instrument to support enterprises the rapid development of

Method used

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  • Temperature increasing and decreasing adjustment instrument based on semiconductor refrigeration and heating technology
  • Temperature increasing and decreasing adjustment instrument based on semiconductor refrigeration and heating technology
  • Temperature increasing and decreasing adjustment instrument based on semiconductor refrigeration and heating technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Such as figure 1 As shown, the first temperature rise and fall adjustment instrument based on semiconductor refrigeration and heating technology provided in this embodiment includes a power supply 1, a temperature rise and fall adjustment control board 2, a load heat conducting plate 3, a primary water cooling head 4, and a primary TEC device 5. The primary water pump 6 and the secondary cooling and heating interaction system 7, wherein the power supply 1 is electrically connected to the temperature rise and fall adjustment control board 2, and a temperature sensor 301 is provided in the load heat conducting plate 3; the load The heat conduction plate 3 is located directly above the primary water cooling head 4, and several primary TEC devices 5 arranged in a matrix are arranged between the load heat conducting plate 3 and the primary water cooling head 4, wherein the The N-type semiconductor plate of the primary TEC device 5 is in contact with the object heat conductin...

Embodiment 2

[0054] Such as figure 2 As shown, this embodiment provides another temperature rise and fall adjustment instrument based on semiconductor refrigeration and heating technology, which is different from Embodiment 1 in that it also includes an auxiliary stage cooling and heating interaction system 8, wherein the auxiliary stage The cooling and heating interaction system 8 includes a first auxiliary water cooling head 801, a second auxiliary water cooling head 802, a third auxiliary water cooling head 803, an auxiliary TEC device 804, an auxiliary water pump 805 and an auxiliary water heat exhaust pipe 806; The first auxiliary water cooling head 801, the second auxiliary water cooling head 802 and the third auxiliary water cooling head 803 are arranged sequentially from top to bottom, and between the first auxiliary water cooling head 801 and the second auxiliary water cooling head Between the two auxiliary stage water cooling heads 802 and between the second auxiliary stage wate...

Embodiment 3

[0062] Such as image 3 As shown, this embodiment provides a third temperature rise and fall adjustment instrument based on the semiconductor refrigeration and heating technology on the basis of the second embodiment, which is different from the second embodiment in that it also includes the final cooling and heating interaction system , wherein, the final cooling and heating interaction system 9 includes a first final water cooling head 901, a second final water cooling head 902, a third final water cooling head 903, a final TEC device 904, a final water pump 905 and a final Waterway heat removal pipe 906; the first final stage water cooling head 901, the second final stage water cooling head 902 and the third final stage water cooling head 903 are arranged sequentially from top to bottom, and at the first final stage Between the water-cooling head 901 and the second final-stage water-cooling head 902 and between the second-stage final-stage water-cooling head 902 and the thi...

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PUM

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Abstract

The invention relates to the field of temperature increasing and decreasing devices, and discloses a temperature increasing and decreasing adjustment instrument based on semiconductor refrigeration and heating technology. The temperature increasing and decreasing adjustment instrument uses a thermoelectric refrigeration sheet as the base of a cold and hot source, is constructed through a loading heat conduction board, a water-cooling head, a water pump, a waterway thermal discharge pipe and a temperature increasing and decreasing adjustment control board, and has the advantages of small size,light weight, being convenient to move, fast temperature increasing and decreasing speed, high temperature control accuracy, low manufacturing cost and the like. The temperature increasing and decreasing adjustment instrument can further provide a refrigeration heating loading plane with any temperature environment from -65-120 degrees Celsius, and has high load capacity, that is, when the refrigeration heating loading plane bears small and medium-sized micro-electronic products, the external temperature of the small and medium-sized micro-electronic products or the monitoring temperature of chips can be optionally adjusted between -50-100 degrees Celsius, and the temperature increasing and decreasing adjustment instrument can create a variety of different temperature environments or required continuous temperature cycle environment for the production and manufacture of various commercial and industrial electronic products and scientific experimenters.

Description

technical field [0001] The invention belongs to the field of heating and cooling equipment, and in particular relates to a temperature rising and falling adjustment instrument based on semiconductor refrigeration and heating technology, which is applicable to the production and manufacture of optical communication components and product research and development experiments, and is especially suitable for applications such as optical communication In the production, manufacturing and laboratory process of chips, TO devices, optical devices and optical modules, etc., it provides a temperature environment for creating industrial-grade low and high temperature environments or continuous high and low temperature cycle. Background technique [0002] In the current field of optical communication and electronic product manufacturing, for the production and manufacturing of optical communication components and electronic products, as well as product research and development experiment...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02
CPCF25B21/02F25B2321/02
Inventor 胡晓
Owner 胡晓
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