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A kind of ceramic bond diamond grinding wheel with low temperature thermosetting adhesion layer and preparation method thereof

A ceramic bond, low temperature heat technology, used in metal processing equipment, manufacturing tools, grinding/polishing equipment, etc., can solve the problems of grinding wheel bursting, abrasive waste, etc., to achieve low abrasive cost, simple and efficient production process, saving The effect of production costs

Active Publication Date: 2020-09-25
江苏赛扬精工科技有限责任公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the process of using the grinding wheel, the abrasive layer is often separated from the substrate and cannot be used when the last few millimeters of the abrasive layer remain, resulting in waste of abrasives, and the heat from the grinding interface is transferred to the grinding wheel substrate during grinding. grinding wheel burst

Method used

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  • A kind of ceramic bond diamond grinding wheel with low temperature thermosetting adhesion layer and preparation method thereof
  • A kind of ceramic bond diamond grinding wheel with low temperature thermosetting adhesion layer and preparation method thereof

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Embodiment 1

[0027] see Figure 1-2 As shown, a vitrified bonded diamond grinding wheel with a low-temperature thermosetting coating includes a substrate 1 , a low-temperature thermosetting coating 2 , an abrasive layer 3 and a high-strength structural adhesive 4 .

[0028] The above-mentioned preparation method of the vitrified bond diamond grinding wheel with low-temperature thermosetting type attached layer is as follows:

[0029] For the production of the substrate attachment layer, put the substrate into the mold so that the attachment layer material can directly contact the outer circle of the substrate; the white corundum, aluminum oxide, zinc oxide, and phenolic resin powder in the attachment layer raw materials are in a mass ratio of 1:6 :5:3 After mixing evenly, feed the material to the mold with a molding density of ρ=1.8, and then heat press it on a hot press with a pressure of 30t and 200°C for 20 minutes, so that the attached layer material is solidified on the outer circle o...

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Abstract

The invention discloses a vitrified bonded diamond grinding wheel with a low-temperature thermosetting coating and a preparation method thereof, comprising an abrasive layer, a low-temperature thermosetting coating and a metal substrate. The attached layer is the transition layer between the abrasive layer and the matrix. The manufacturing process of the low-temperature thermosetting layer is simple and efficient, the yield rate is high, and the applicability is strong. The vitrified bond grinding wheel with this layer can not only effectively improve the utilization rate of the abrasive layer of the grinding wheel, reduce the probability of grinding wheel stripping, and The thermal conductivity of the disclosed attachment layer is much lower than that of superabrasives and metal substrates, so it can avoid the cracking of the grinding wheel caused by heat transfer from the grinding interface to the grinding wheel substrate during grinding.

Description

technical field [0001] The invention relates to a technology for adding a composite material attachment layer between the abrasive layer of a vitrified bond diamond grinding wheel and a matrix, and belongs to the technical field of diamond grinding wheel preparation. Background technique [0002] In the prior art, the bonded grinding wheel is mainly based on resin bond, and the application of vitrified bond is seldom and the technology is very difficult. The traditional preparation process of vitrified bonded diamond grinding wheel is to cold press into a green body first, then solidify and sinter, match the sintered abrasive layer with the substrate, then bond and shape, and trim to the required shape and size. During the sintering process of vitrified bonded grinding wheels, deformation often occurs. Therefore, in the process of using the grinding wheel, the abrasive layer is often separated from the substrate and cannot be used when the last few millimeters of the abrasi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D3/14B24D18/00
CPCB24D18/0009B24D3/18B24D3/342
Inventor 谢亚辉陈坤鹏
Owner 江苏赛扬精工科技有限责任公司
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