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High temperature resistant and solvent resistant phenolic resin glue sheet

A phenolic resin, solvent-resistant technology, applied in the direction of adhesives, adhesive types, conjugated diene adhesives, etc., to achieve the effect of broadening the application field, excellent impact resistance, strength and toughness

Active Publication Date: 2018-11-06
长春峰泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional chlorinated rubber method, isocyanate method and other technologies can no longer meet the new requirements, and new adhesives are needed to improve the quality of rubber composite products

Method used

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  • High temperature resistant and solvent resistant phenolic resin glue sheet
  • High temperature resistant and solvent resistant phenolic resin glue sheet

Examples

Experimental program
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Effect test

preparation example Construction

[0022] In one embodiment of the present invention, the phenolic resin is a novolac resin; preferably, a novolac bisphenol A phenolic resin; more preferably, a modified bisphenol A phenolic resin; further preferably The preparation method of the modified bisphenol A type phenolic resin comprises the steps:

[0023] Take phenolic resin, dissolve it in an organic solvent at 80°C, then add modified monomer I and dibutyltin dilaurate, heat up to 90°C and stir for 1 to 2 hours, then cool down to 70°C, add modified monomer Body II, stirred for 3 hours, cooled to room temperature, concentrated, filtered, and dried to obtain modified phenolic resin.

[0024] The phenolic resin may be a conventional novolac bisphenol A phenolic resin on the market, for example, a bisphenol A phenolic resin with a weight average molecular weight of 800-2500 and a hydroxyl equivalent of 115-125 may be used. The organic solvent is not particularly limited, and conventional solvents can be selected, such a...

Embodiment 1

[0040] Embodiment 1 provides a high-temperature-resistant, solvent-resistant phenolic resin film, including nitrile rubber 25, phenolic resin 50, curing agent 2, curing accelerator 0.2, and vulcanizing agent 0.2 in parts by weight.

[0041] The nitrile rubber is nitrile-41 rubber, which is purchased from China Lanzhou Petrochemical Company, and the brand name is N21; the phenolic resin is novolac bisphenol A phenolic resin, which is purchased from Jiangyin Dongpeng International Trade Co., Ltd. The curing agent is a hexamethylenetetramine curing agent mixed with DCP; the curing accelerator is a mixture of 2-mercaptobenzothiazole and dibenzothiazole disulfide in a weight ratio of 2:1.

Embodiment 2

[0043] Example 2 provides a high-temperature-resistant, solvent-resistant phenolic resin film, including nitrile rubber 40, phenolic resin 80, curing agent 10, curing accelerator 1.5, and vulcanizing agent 0.4 in parts by weight.

[0044] The nitrile rubber is nitrile-41 rubber, purchased from Lanzhou Petrochemical Company of China, with the brand name N21; the phenolic resin is novolac bisphenol A phenolic resin, purchased from Jiangyin Dongpeng International Trade Co., Ltd., with the brand name DPS-2110; The curing agent is a hexamethylenetetramine curing agent mixed with DCP; the curing accelerator is a mixture of 2-mercaptobenzothiazole and dibenzothiazole disulfide in a weight ratio of 2:1.

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Abstract

The invention relates to the field of glue and particularly relates to a high temperature resistant and solvent resistant phenolic resin glue sheet. The glue sheet at least comprises, by weight, 25 to40 parts of nitrile rubber, 50 to 80 parts of phenolic resin, 2 to 10 parts of a curing agent, 0.2 to 1.5 parts of a curing accelerator and 0.2 to 0.4 parts of a vulcanizing agent. The phenolic resinglue sheet is modified by using monomers containing a polycyclic group and an unsaturated double bond group so that the curing mode of the phenolic resin is changed, the dimensional shrinkage of thephenolic resin glue sheet during curing is avoided and the dimensional stability of the glue sheet in use is improved. Through compounding of raw materials in different ratios and modification of thephenolic resin with different monomers, the phenolic resin glue sheet has high temperature resistance. Through high temperature heat treatment on the glue sheet, all performances can be kept in good levels, the application field of the phenolic resin glue sheet is broadened and the service life is prolonged.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a high-temperature-resistant and solvent-resistant phenolic resin film. Background technique [0002] Since the first phenolic-nitrile rubber thermal vulcanization adhesive Metlbond4021 was published in the United States in 1943, it has a history of 70 years and is still widely used in aircraft manufacturing. The reason why phenolic-nitrile rubber thermal vulcanization adhesives can maintain this position is that, in addition to its low price, it is related to other excellent properties, such as bonding various metal materials with high physical and mechanical properties in a relatively wide temperature range It has good elasticity and toughness, so it has good peel strength, impact strength and fatigue performance; it has excellent heat aging and atmospheric aging properties; it has excellent solvent resistance and salt spray resistance. However, when a novolak resin with good heat res...

Claims

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Application Information

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IPC IPC(8): C09J161/14C09J109/02
CPCC08L2201/08C09J161/14C08L9/02
Inventor 冯俊山刘冬梅冯笑男
Owner 长春峰泰科技有限公司
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