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Direct-write plasma spraying technology applied to semiconductor industry

A plasma and semiconductor technology, used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, coating, etc., can solve problems such as influence and damage, and achieve low production cost, high manufacturing efficiency, and no production environment. The effect of restriction

Inactive Publication Date: 2018-11-06
SHENYANG FORTUNE PRECISION EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, no matter how corrosion-resistant the coating is, it has a certain lifespan. When it reaches the end of its lifespan, if it is not found in time, it will still affect other parts and cause unforeseen damage.

Method used

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  • Direct-write plasma spraying technology applied to semiconductor industry
  • Direct-write plasma spraying technology applied to semiconductor industry
  • Direct-write plasma spraying technology applied to semiconductor industry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The present invention takes the silicon ring in the semiconductor etching machine as an example. In order to prevent the etching gas from damaging the silicon ring, Al is usually sprayed outside the silicon ring. 2 o 3 coating. Such as figure 2 As shown, the present invention provides a method for preparing a sensor by directly writing plasma spraying technology on a semiconductor silicon ring, and monitoring the coating change of the silicon ring, which specifically includes the following steps:

[0027] (1) Spraying Al on the silicon ring by atmospheric plasma spraying 2 o 3 Coating, for distinction, marked as Al 2 o 3 -1. The spraying process parameters are: spraying power is set to 35KW, the powder injection angle is 90°, the main gas is argon, the gas flow rate is 0.8L / s, the auxiliary gas is hydrogen, the gas flow rate is 0.083L / s, and the spraying distance is 130mm. The spray rate is 500 / s, and the coating thickness is about 75 microns.

[0028] (2) in Y...

Embodiment 2

[0034] Taking the nozzle in the semiconductor etching machine as an example, the nozzle is more likely to be corroded by the etching gas than the silicon ring, usually sprayed with Y 2 o 3 coating to prevent corrosion. Such as image 3 As shown, the present invention provides a method for preparing a humidity sensor by directly writing plasma spraying technology on a semiconductor nozzle and monitoring the coating change of the nozzle, which specifically includes the following steps:

[0035] (1) Spray Y on the silicon ring by atmospheric plasma spraying 2 o 3 Coating, spraying process parameters are: spraying power is set to 30KW, powder injection angle is 90°, the main gas is argon, the gas flow rate is 40L / min, the auxiliary gas is hydrogen, the gas flow rate is 15L / min, and the spraying distance is 220mm , the coating thickness is about 25 microns.

[0036] (2) in Y 2 o 3 Spray a layer on the outside of the coating with an area of ​​about 1-2cm 2 About the semicond...

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Abstract

The invention relates to a direct-write plasma spraying technology applied to a semiconductor industry. For a part with a coating in a semiconductor, the direct-write plasma spraying technology is used for writing in a sensor on the coating, change of quality of the coating is monitored by virtue of the sensor, and the effect of replacing the coating of the part before life limit of the coating comes is achieved. The method comprises the following steps: (1) according to needs of a semiconductor part, coating a functional coating; (2) spraying another small-area coating above the coating, wherein the small-area coating is obviously different from the first functional coating layer in a certain property and can not adopt a sensitive metal coating in the semiconductor industry; (3) above thesecond coating layer, spraying a coating the same in material with the first coating layer, wherein the thickness of the sprayed coating is slightly smaller than that of the first coating layer; and(4) spraying wireless above the coating, so as to connect external monitoring equipment.

Description

technical field [0001] The invention relates to a direct writing plasma spraying technology applied in the semiconductor industry. Background technique [0002] With the rapid development of the semiconductor industry, the reduction of the size of semiconductor devices and the increase of the size of silicon wafers, plasma etching technology has been more and more widely used in the preparation of semiconductor devices. Etching gas for plasma etching is commonly used CF 4 , SF 6 、NF 3 , Cl 2 In the dry etching process of plasma, these etching gases will not only etch semiconductor parts, but also corrode key parts such as aluminum and aluminum alloy in the etching chamber. At present, in the semiconductor industry, in order to prevent parts from being corroded, a layer of Al is usually made outside the parts. 2 o 3 , Y 2 o 3 and other coatings, but the coating has a certain life. When the coating reaches the limit of life, it is necessary to replace the parts, which ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/66C23C4/01C23C4/08C23C4/11C23C4/134C23C24/10H10N10/01H10N50/01H10N50/10
CPCH01L21/02104H01L22/12C23C4/01C23C4/08C23C4/11C23C4/134C23C24/10C23C28/32C23C28/3455H01L21/02178H01L21/02266H01L21/02192H10N10/01H10N50/01H01L22/26H01L22/24H01L21/3065H01L21/67069H01L21/67242G01N27/048G01R27/02H01L21/02175H10N50/10
Inventor 徐俊阳邵颖李加
Owner SHENYANG FORTUNE PRECISION EQUIP CO LTD