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A Design Method of Inner Layer Graphics for Improving Drilling and Pulling Copper

A technology of inner layer graphics and design methods, applied in the direction of electrical connection formation of printing components, etc., can solve the problems of copper pulling, enlargement, and increased cutting resistance of drill bits.

Active Publication Date: 2021-07-06
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the development of precision technology, the ring width of the inner annular ring is required to be smaller and smaller, which will cause the diameter of the part to be drilled in the round copper PAD to be much larger than the width of the annular ring to be retained, which is very easy to drill. Copper pulling occurs, that is, the part of the annular ring that needs to be retained is pulled out, causing the board to be scrapped; and as the copper thickness of the inner layer of the printed circuit board continues to increase, the cutting resistance of the drill bit during drilling will also continue to increase. In this way, the pulling force of the drill bit on the inner layer copper foil will also increase continuously, which further increases the problem of pulling out the inner layer ring during the drilling process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The present embodiment provides a method for manufacturing a PCB, which includes a method for improving the inner layer pattern design of drilling and pulling copper. The specific process is as follows:

[0023] (1) Material cutting: cut out the inner core board according to the size of 520mm×620mm, the thickness of the inner core board is 0.2mm, and the thickness of the outer copper foil is 1OZ; according to the design requirements, the inner core board is reserved for useful The position where the hole is drilled after pressing is called the drilling position.

[0024] (2) The inner layer circuit production (negative film process): the inner layer pattern is transferred, and the photosensitive film is coated on the inner layer core board with a vertical coater, and the film thickness of the photosensitive film is controlled to 8 μm; -6 exposure rulers (21 exposure rulers) to complete the inner layer circuit exposure on the inner core board, transfer the inner layer pa...

Embodiment 2

[0040]This embodiment provides a method for manufacturing a PCB, especially a method for preventing copper pulling during drilling; the manufacturing steps in this embodiment are basically the same as those in Embodiment 1, except that steps (1) and (2) ), the details are as follows: in step (1), when the thickness of the outer layer copper foil on the inner layer core board is less than 1OZ; the outer diameter of the ring pattern in the corresponding step (2) is 0.4mm larger than the diameter of the drilling position.

[0041] According to the method of Example 2, 1000 PCBs were repeatedly fabricated, and there was no problem of copper pulling on the PCB during drilling.

Embodiment 3

[0043] This embodiment provides a method for manufacturing a PCB, especially a method for preventing copper pulling during drilling; the manufacturing steps in this embodiment are basically the same as those in Embodiment 1, except that steps (1) and (2) ), as follows: in step (1), when the thickness of the outer layer copper foil on the inner layer core board is greater than 2OZ; the outer diameter of the ring pattern in the corresponding step (2) is 0.6mm larger than the diameter of the drilled position.

[0044] According to the method of Example 3, 1000 PCBs were repeatedly fabricated, and there was no problem of copper pulling on the PCB during drilling.

[0045] In other embodiments of the present invention, according to the maximum drilling deviation error d / 2mm allowed in the actual production process, the inner diameter of the ring pattern is designed to be dmm smaller than the drilling position on one side (that is, the maximum drilling deviation error). For example,...

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PUM

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Abstract

The invention discloses a method for designing an inner layer pattern for improving drilling and pulling copper, comprising the following steps: the inner layer core board is provided with a drilling position, and the drilling position is a position that needs to be drilled in subsequent processing ; transfer the inner layer graphics on the film to the inner core board through the negative film process, the inner layer graphics include a ring shape whose outer diameter is larger than the diameter of the drilled hole, and the inner diameter of the ring shape is smaller than the The diameter of the drill hole position; the exposed copper on the inner core board is removed by etching, and then the film is peeled off, the inner layer circuit is formed from the inner layer pattern, and the ring is formed from the ring pattern. Adopting the method of the present invention can reduce the cutting resistance of the drill bit and the pulling force of the drill bit on the inner copper foil in the later stage of drilling, thereby achieving the purpose of reducing copper pulling by drilling, effectively reducing the scrap rate of the board, and improving the quality of the board. quality.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to an inner layer graphic design method for improving drilling and copper pulling. Background technique [0002] In order to achieve the purpose of connecting different layers of circuits in the printed circuit board, it is necessary to design the inner layer hole ring at the drilling position in advance before the printed circuit board is pressed. The current inner layer hole ring design method first drills corresponding holes in the inner layer circuit A round copper PAD is made at the position, and the diameter of the round copper PAD is the sum of the diameter of the drill hole and the width of the inner layer hole ring that is twice the design requirement. After pressing, the copper in the middle of the round copper PAD is drilled to form an inner ring Layer hole rings, and then connect the holes with copper plating in the holes by electroplating, s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
CPCH05K3/42
Inventor 莫崇慧彭卫红莫崇明孙保玉
Owner SHENZHEN SUNTAK MULTILAYER PCB