Thin optoelectronic modules with apertures and their manufacture

Abstract

The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

Description

technical field [0001] The present disclosure relates to methods of manufacturing optical devices, such as optoelectronic modules, eg proximity sensors, and corresponding devices and modules, respectively. Fabrication can be wafer-level mass-fabrication. Optics can be very thin and can include precisely positioned holes. Corresponding optics can be integrated, for example, in consumer-oriented products such as smartphones, gaming systems, laptops, tablets and wearable technology. Background technique [0002] definition [0003] "Wafer": an article substantially in the shape of a disk or plate whose extension in one direction (z-direction or vertical) is relative to its extension in the other two directions (x and y-direction or transverse or horizontal) The extension on it is small. Typically, on a (non-blank) wafer, a number of similar structures or items are arranged or arranged therein (eg, on a rectangular grid). The wafer may have openings or apertures, and the wa...

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Problems solved by technology

This facilitates an increased photovoltaic module footprint

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