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A self-encapsulation method for a sheet-like flexible piezoresistive sensor

A piezoresistive sensor and self-encapsulation technology, which is applied in the field of sensors, can solve problems such as poor mobility and wearability, affect component life, and poor stability, and achieve novel and simple preparation methods, prolong service life, and maintain stability.

Active Publication Date: 2020-11-13
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the field of medical diagnosis, the detection of human physiological information is an effective way for disease diagnosis and health status assessment, but traditional infrared photoelectric devices and rigid pressure sensors are poor in mobility and wearability, and electronic skin has the potential to open up personalized medicine New doors in monitoring, such as real-time measurement of patient pulse, measurement of intracranial pressure during surgery, measurement of ureteral peristalsis frequency, etc.
However, so far, there has not been a flexible piezoresistive sensor with a fully encapsulated structure.
Unpackaged piezoresistive sensors have obvious disadvantages: the electrodes exposed to the air and the piezoresistive sensitive layer are easily corroded and damaged, which affects the life of the components; the stability is poor, and the sensing function is easily affected; the application of the sensor is limited, such as in the field of human health, only Can be applied to the outer surface of the human body, but not for in-vivo monitoring

Method used

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  • A self-encapsulation method for a sheet-like flexible piezoresistive sensor
  • A self-encapsulation method for a sheet-like flexible piezoresistive sensor
  • A self-encapsulation method for a sheet-like flexible piezoresistive sensor

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Embodiment 1: based on a sensor package with a film thickness of 0.10 mm.

[0018] Concrete preparation is carried out as follows:

[0019] 1. Prepare two layers of Ecoflex films with a thickness of 0.10mm by using the rotary glue method, and the rotation speed is 200 rpm; the length and width of the smaller ones are: 30mm and 20mm; the length and width of the larger ones are 40mm and 30mm;

[0020] 2. Use 3D printing to prepare a mold of appropriate size, including the tank and the card frame;

[0021] 3. Place the sensor between two layers of film to form a sandwich structure and place it in the tank;

[0022] 4. Tighten the card frame, inject the pre-prepared Ecoflex solution into the gap between the card frame and the reservoir with a rubber dropper or syringe;

[0023] 5. Keep warm at 60°C for a period of time to complete the package, and the final package thickness is 0.22mm.

Embodiment 2

[0024] Embodiment 2: Based on the sensor package with a film thickness of 0.50 mm.

[0025] Concrete preparation is carried out as follows:

[0026] 1. Prepare two layers of Ecoflex films with a thickness of 0.50mm by using the rotary coating method, and the rotation speed is 150 rpm; the length and width of the smaller ones are: 30mm and 20mm; the length and width of the larger ones are 40mm and 30mm;

[0027] 2. Use 3D printing to prepare a mold of appropriate size, including the tank and the card frame;

[0028] 3. Place the sensor between two layers of film to form a sandwich structure and place it in the tank;

[0029] 4. Tighten the card frame, inject the pre-prepared Ecoflex solution into the gap between the card frame and the reservoir with a rubber dropper or syringe;

[0030] 5. Keep warm at 60°C for a period of time to complete the package, and the final package thickness is 0.11mm.

Embodiment 3

[0031] Embodiment 3: based on a sensor package with a film thickness of 1.0 mm.

[0032] Concrete preparation is carried out as follows:

[0033] 1. Prepare two layers of Ecoflex films with a thickness of 1.0mm by using the rotary coating method, and the rotation speed is 100 rpm; the length and width of the smaller ones are: 30mm and 20mm; the length and width of the larger ones are 40mm and 30mm;

[0034] 2. Use 3D printing to prepare a mold of appropriate size, including the tank and the card frame;

[0035] 3. Place the sensor between two layers of film to form a sandwich structure and place it in the tank;

[0036] 4. Tighten the card frame, inject the pre-prepared Ecoflex solution into the gap between the card frame and the reservoir with a rubber dropper or syringe;

[0037] 5. Keep warm at 60°C for a period of time to complete the package, and the final package thickness is 2.0mm.

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Abstract

The invention discloses a self-packaging method of a sheet-shaped flexible piezoresistive sensor. The self-packaging method of a sheet-shaped flexible piezoresistive sensor includes the steps: arranging two packaging material films up and down in a clamped manner to form a sandwich structure, installing the sandwich structure into a die, filling the die with packaging material liquid, after solidification, and finally realizing self-packaging after removing the die, wherein the young modulus of the packaging material is consistent with the flexible piezoresistive sensor. The self-packaging method of a sheet-shaped flexible piezoresistive sensor can realize a self-packaging sealing structure of the flexible piezoresistive sensor under assistance of the die. The self-packaging sealing structure isolates the sensitive material of the sensor from the external environment, such as contacting air, moisture and the like, thus greatly widening the application scene of the piezoresistive sensorto some harsh environments, such as water and even tissue fluid, being conductive to maintenance of stability of performance, and effectively prolonging the service life of the piezoresistive sensorat the same time. The self-packaging method of a sheet-shaped flexible piezoresistive sensor has the advantages of being novel and simple, being low in cost, being significant in effect, being excellent in performance, and having great potential and advantage for the clinic medical field.

Description

technical field [0001] The invention belongs to the field of sensors, in particular to a self-encapsulation method of a sheet-shaped flexible piezoresistive sensor. Background technique [0002] In recent years, the market's demand for artificial intelligence-related wearable devices has become increasingly strong, and more and more devices have realized the integration and intelligence of sensors to detect special signals, which has driven the development and development of flexible pressure sensors, one of the core components, in different fields. Apps are also rapidly emerging. As a commonly used pressure sensor, the flexible piezoresistive sensor is an important component of the electronic skin. It can convert mechanical deformation into a corresponding electrical signal when it is subjected to an external force. It has many advantages such as high sensitivity, high stability, and wide sensitive pressure range. . Electronic skin has great application potential in the f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L9/06
CPCG01L9/06
Inventor 王宗荣刘苏宇李皓盛王珊牛韶玉简阅陈国瑞周麟铭王子琦许露杭苗雨欣杜丕一韩高荣
Owner ZHEJIANG UNIV
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