An energy control method for reducing warpage in laser bending of thin metal plates
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DALIAN UNIV OF TECH
- Publication Date
- 2019-07-16
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention belongs to the field of laser bending forming of thin metal plates, and relates to an energy control method for reducing the warping amount of laser bending forming of thin metal plates. Background technique
[0002] Compared with traditional mold processing methods, laser bending forming is a flexible, moldless, force-free and non-contact rapid prototyping technology, which is easy to automate. However, the warping deformation of the free end of the metal sheet during the laser linear scanning process seriously affects the forming quality. Although the warping amount is small, in some occasions that require high precision, this deformation amount may cause a very large impact. The current research believes that there are two main reasons for the warping phenomenon: one is the non-uniform temperature field along the scanning line generated by the laser energy input; the other is that the geometric constraints on different points on the sc...