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31 results about "Laser bending" patented technology

Reverse laser forming method for single-segment arc surface of metal sheet

InactiveCN111496062AGuaranteed smoothnessEffective guidance for accurate and rapid flexible bending formingMetal-working feeding devicesPositioning devicesScan lineLaser scanning
The invention belongs to the field of metal sheet laser bending forming, and particularly relates to a reverse laser forming method for a single-segment arc surface of a metal sheet. The reverse laserforming method can be used for rapid bending and forming of a single-segment arc surface or a multi-segment arc surface structure of the metal sheet. Considering the influence of the spacing of a scanning line on the smoothness of the formed arc surface, the reverse laser forming method can finish the route planning for the arc surface expected to be formed by reversing the spacing of the scanning line and the bending angle of each scanning line, the laser power, laser defocusing amount, laser scanning speed and scanning times on each scanning line are changed to ensure that the bending angleof each scanning line is the same, and the high-precision laser rapid bending and forming of different types of arc surfaces is achieved. The reverse method of the arc surface can guide the precise,rapid and flexible bending and forming of the specific arc surface effectively, and ensure the smoothness of the arc surface as much as possible under the appropriate small spacing of the scanning line; at the same time, through similar means, multi-segment arc surface processing can be completed.
Owner:DALIAN UNIV OF TECH

Novel stretch-bending process for metal plate laser thermoforming

InactiveCN111822553AIncrease bend angleReduce reboundShaping toolsFiberNumerical control
The invention provides a method for achieving laser bending metal plate forming through a pre-stretch-bending method. Resilience can be reduced to a large extent, and then the bending angle of a plateis increased. The method comprises the steps that firstly, a formed workpiece is fixed to a three-dimensional numerical control platform, one end of the workpiece is fixed through a clamp, and a stretch bending device firstly applies longitudinal tension and then applies transverse pressure to the other free end of the workpiece; and then the upper surface of the plate is heated in a scanned modeby using laser, finally, after the hating area of the plate is completely cooled, the stretch bending device is removed, and the transverse pressure and the longitudinal tension are relieved. A largenumber of literatures prove that the stress state inside the plate can be changed under bending force, more tangential pressure stress generated on the inner side of a neutral layer of the laser heated area is converted into tensile stress, the whole cross section of the plate is under the action of the tensile stress in the tangential direction, and after relieving, resilience of inner-layer fibers and outer-layer fibers counteract each other so that the resilience can be greatly reduced, and then the bending angle of the plate is increased; and the method is suitable for forming of high-hardness, high-brittleness and difficult-to-deform and medium-thickness plate materials, and has a great application prospect in the fields of aerospace, medical treatment and automobile manufacturing.
Owner:CHINA UNIV OF PETROLEUM (EAST CHINA)

Bending and forming method of thin silicon wafer

The invention discloses a bending and forming method of a thin silicon wafer, which scans the thin silicon wafer by utilizing Nd:YAG pulse laser and provides power and temperature conditions for bending the thin silicon wafer by thermal action of laser and a thin silicon wafer material. In the bending and forming method, extra temperature environment does not need to be provided in the stage of laser scanning, the bending and forming mainly utilize the thermal action of the laser and the thin silicon wafer material to realize the plastic characteristic of the silicon wafer, and further are realized by stress difference generated by different temperatures on the upper surface and the lower surface. In the bending and forming method, 1064nm pulse laser is utilized to realize bending and forming of the silicon material with the thickness being 0.1mm-0.3mm, a 30-degree bending angle can be obtained, the bending quality is good, simultaneously, the operation is convenient, and the technology is simple, so that the bending and forming method is beneficial to realizing automatization. The laser bending technology adopted by the invention belongs to a non-contact processing form, has no contact damage to the surface of the material, and can effectively avoid damage caused by being contacted with external force in the bending process of the silicon wafer.
Owner:DALIAN UNIV OF TECH

Prestress laser bending forming method for aluminum alloy high-ribbed wallboard

The invention provides a prestress laser bending forming method for an aluminum alloy high-ribbed wallboard. The prestress laser bending forming method comprises the steps that S1, a plurality of to-be-formed areas are divided on the breadth of the aluminum alloy high-ribbed wallboard; S2, any to-be-formed area is selected to be subjected to pre-bending loading, so that the to-be-formed area enters slight plasticity; S3, a laser beam is used for scanning ribs with concentrated elastic stress in the to-be-formed area; S4, after the aluminum alloy high-ribbed wallboard is cooled to the room temperature, unloading is conducted, and forming of the to-be-formed area subjected to pre-bending loading is completed; and S5, the step S2, the step S3 and the step S4 are repeated in sequence for the rest to-be-formed areas, and an aluminum alloy high-ribbed wallboard bending forming piece is obtained. The pre-bending loading is carried out on the to-be-formed areas, so that the to-be-formed areas enter slight plasticity, and then the laser beam is used for scanning the rib parts with concentrated elastic stress, so that the bending forming of the aluminum alloy high-ribbed wallboard is realized, the overload damage and damage of the high-ribbed wallboard are avoided, and the forming precision of the high-ribbed wallboard is improved.
Owner:SHANGHAI SPACE PRECISION MACHINERY RES INST

Bending and forming method of thin silicon wafer

The invention discloses a bending and forming method of a thin silicon wafer, which scans the thin silicon wafer by utilizing Nd:YAG pulse laser and provides power and temperature conditions for bending the thin silicon wafer by thermal action of laser and a thin silicon wafer material. In the bending and forming method, extra temperature environment does not need to be provided in the stage of laser scanning, the bending and forming mainly utilize the thermal action of the laser and the thin silicon wafer material to realize the plastic characteristic of the silicon wafer, and further are realized by stress difference generated by different temperatures on the upper surface and the lower surface. In the bending and forming method, 1064nm pulse laser is utilized to realize bending and forming of the silicon material with the thickness being 0.1mm-0.3mm, a 30-degree bending angle can be obtained, the bending quality is good, simultaneously, the operation is convenient, and the technology is simple, so that the bending and forming method is beneficial to realizing automatization. The laser bending technology adopted by the invention belongs to a non-contact processing form, has no contact damage to the surface of the material, and can effectively avoid damage caused by being contacted with external force in the bending process of the silicon wafer.
Owner:DALIAN UNIV OF TECH

Flexible loading platform for sheet metal laser bending

The invention provides a flexible loading platform suitable for sheet metal laser bending forming, which relates to the technical field of laser processing and forming, including a top cover, a slide table, a bottom plate, an upper pressing head, a lower pressing head, a force sensor, a lift, a motor assembly and A plurality of columns, the top cover, sliding table, and bottom plate are arranged in parallel in sequence and connected by multiple parallel columns. The upper pressing head and the lower pressing head are installed on the top cover and sliding table respectively; the elevator and motor components are all installed on the bottom plate On the top, the upper and lower parts of the force sensor are respectively installed on the slide table and the elevator; when the sheet material is subjected to laser bending and forming operations, the motor assembly drives the elevator to rotate so as to drive the lower pressing head to move closer to the upper pressing head. The invention performs laser bending and forming flexible loading operation on the sheet material used for aerospace products, improves the processing quality of the sheet material, satisfies the processing requirements of various sheet materials used for aerospace products, and has broad application prospects and popularization value.
Owner:SHANGHAI SPACE PRECISION MACHINERY RES INST
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