High-power 3D integrated three-phase EMI filter

A filter and high-power technology, applied in the field of electronic devices, can solve the problems of increasing filter volume, low power density, and difficulty in heat dissipation, and achieve the effects of increasing insertion loss, reducing volume, and improving heat dissipation capacity.

Active Publication Date: 2018-11-23
XIDIAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This method will increase the volume of the filter, resulting in low power density, and at the same time, it is difficult to dissipate heat, and the magnetic ring is seriously heated.

Method used

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  • High-power 3D integrated three-phase EMI filter
  • High-power 3D integrated three-phase EMI filter
  • High-power 3D integrated three-phase EMI filter

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Embodiment Construction

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0035] refer to figure 1 , the high-power 3D integrated three-phase EMI filter circuit of the present invention includes a three-phase planar common-mode inductor 1 and three flat-plate common-mode capacitors 2, and each phase self-inductance L of the three-phase planar common-mode inductor 1 CM connected in series to the main circuit, each corresponding planar common mode capacitor C Y Connected between the main circuit and ground, L CM with C Y Constitutes an inverse Γ-type low-pass filter, forming a low-impedance path for the noise signal. When the noise signal flows through the filter from the U, V, and W three-phase lines, it will be filtered out through the low-impedance path without being transmitted. To U', V', W' phase line side.

[0036...

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Abstract

The invention discloses a high-power 3D integrated three-phase EMI filter, comprising a three-phase planar common mode inductor (1) and three flat-plate common mode capacitors (2). The inductor includes four layers of planar magnetic cores (11a, 11b, 11c, 11d), two sets of three-phase horizontal windings (12a, 12b), a three-phase vertical winding (13), and a ceramic substrate (14), wherein the horizontal windings (12a, 12b) are respectively located on an upper surface of the magnetic core (11a) and a lower surface of the magnetic core (11d), each magnetic core is punched with two rows of concentric holes, the three-phase vertical winding (13) is located in a through hole, and the ceramic substrate (14) is used for isolation. Each capacitor comprises dielectric material (21), an insulatingsupport (22), and a stamped-type conductor layer (23). The three capacitors are identical in structure, laminated and attached to a side of the inductor to form a 3D interconnect structure. Compared with the prior art, the volume of the high-power 3D integrated three-phase EMI filter is reduced, the insertion loss performance is improved, and can be used for a vehicle motor drive system.

Description

technical field [0001] The invention belongs to the technical field of electronic devices, and in particular relates to a 3D integrated three-phase AC EMI filter, which can be used in a vehicle-mounted motor drive system. Background technique [0002] Passive three-phase AC EMI filters are generally composed of discrete inductors, capacitors, and resistors, which can form a low-impedance path for one or more harmonics to suppress higher harmonics. [0003] The traditional passive three-phase AC EMI filter adopts a discrete arrangement of components. This arrangement is limited by the coupling between the components, the distribution parameters of the components, and the installation position. Disadvantages of large size, low space utilization, low power density, complex coupling relationship between devices and strong randomness. Especially in high-power applications of hundreds of kW, these disadvantages are more obvious. [0004] In order to solve the shortcomings of tra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/12H01F27/08H01F27/24H01F27/28H01F27/32H01G4/005H01G4/12
CPCH01F27/08H01F27/24H01F27/28H01F27/2876H01F27/324H01G4/005H01G4/1227H02M1/126
Inventor 郑峰崔梦珂张强赵晓凡
Owner XIDIAN UNIV
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