Curing process for solder mask ink surface of LED light source board

Abstract

The invention discloses a curing process for a solder mask ink surface of a LED light source board. The curing process comprises the following steps: 1) surface treatment of the processing board: cleaning the surface of the processing board to ensure that a first ink layer is printed under the condition of no impurity oxidation; 2) printing the first ink layer : pressing and applying the ink ontothe clean processing board by the pressure of a squeegee; 3) curing the first ink layer: curing the first ink layer by the ultraviolet light fixing lamp with energy parameter of 650-750 mj / cm2, wherein adhesion and considerable hardness should be ensured, and over curing should be avoided; 4) printing the second ink layer : pressing and applying the ink onto the clean processing board cured with the first ink layer by the pressure of a squeegee; 5)curing the second ink layer: curing the second ink layer by the ultraviolet light fixing lamp with energy parameter of 950-1100 mj / cm2, wherein adhesion and considerable hardness should be ensured. The process method has the advantages that production time is short, yield efficiency is high, product precision is high, processing is smooth and reflectivity of ink surface is high.

Description

technical field [0001] The invention relates to the technical field of LED lamps, and more specifically relates to a process for surface curing of solder resist ink on an LED light source board. Background technique [0002] The LED light source mainly emits light through light-emitting diodes, and at the same time reflects light of different wavelengths to ensure that the effective light of the light source reaches the maximum effect. The corresponding ink is a thermosetting and liquid photosensitive white ink with titanium dioxide as the main filler. According to the reflectivity It can be divided into cool white series with general reflectivity (65-75%) and warm white series with high reflectivity (75-85%). [0003] The existing light source board ink surface curing process is mainly divided into two types, one is the conventional printing heat-setting process, including the printing machine scraping the screen printing ink to the copper foil circuit layer and the base ma...

AI Technical Summary

Problems solved by technology

The problems of this process are: first, because of the thermosetting ink during printing, the viscosity is 220-250DPS, the pressure of the scraper is 2.5-2.8KG, the speed is slow, and the mesh number of the screen is 200-250 mesh, which will cause ink thickness Thin, only up to 14-16UM, poor coverage of the ink, so that there is an obvious color difference between the ink on the copper foil and the substrate, and affects the reflectivity of the ink surface

The problems of this process are: first, there is the consistency problem of multiple copies of the film, and the precision is controlled at ±0.10MM, and the shrinkage and deformation precision of the film is controlled at ±0.15MM due to the change of the storage environment, and the total accuracy deviation More than 0.15MM

The long-term use of the film will cause foreign matter to adhere, the color will change, and the ink surfaces will be directly attached to each other, which will cause the surface of the film to lose its luster and reduce the reflectivity of the surface; The ink will lose its luster; the third is that the product has a long baking time and high power consumption, which will cause the substrate to shrink and produce product precision changes, and the flatness will be arched, which is not conducive to LED lamp bead packaging and affects the quality of component packaging. There are also production problems. Long thread cutting time and low production efficiency