Gold plating method for gold fingers and gold finger circuit board
A golden finger and circuit board technology, applied in printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve problems such as rising material costs, inability to completely remove, product scratches, etc., to reduce product production difficulty and production costs , Avoid the possibility of gold plating on the copper surface, reduce the effect of material cost input
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[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] figure 1 The flow chart of the gold plating method for gold fingers provided by the embodiment of the present invention. Such as figure 1 As shown, the present embodiment provides a method for gold-plated gold fingers, and the specific steps of the method are as follows:
[0033] S101 , covering the non-gold-plated area on the outer layer circuit board 100 with a dry film, so that the gold-plated area of the gold finger 110 is exposed.
[0034] Suc...
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