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Siloxane-Containing Solar Cell Metallization Paste

A solar cell, metallization technology, applied in conductive coatings, conductive materials dispersed in non-conductive inorganic materials, metal/alloy conductors, etc., can solve problems such as grid line interference or "necking"

Active Publication Date: 2020-06-02
ZHEJIANG KAIYING NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Intersecting wires forming a printed screen may also result in disturbing or "necked" patterns of screen-printed gridlines that may exhibit narrow-width spaces that result in increased gridline resistance

Method used

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  • Siloxane-Containing Solar Cell Metallization Paste
  • Siloxane-Containing Solar Cell Metallization Paste
  • Siloxane-Containing Solar Cell Metallization Paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0147] metallization paste

[0148] Silicone-free metallization pastes were prepared from the ingredients listed in Table 1.

[0149] Table 1. Metallization Paste A.

[0150]

[0151] To prepare the metallization paste, an organic binder (0.4% by weight of ETHOCEL TM Ethylcellulose (STD4, The Dow Chemical Company)) was dissolved in 6.8% by weight Texanol at 60°C TM (Texanol TM Ester alcohol, Eastman Chemical Company), and 89% by weight of spherical silver particles with an average particle diameter of 2.0 μm (AG-4-8, Tonghe High-Tech Co., Ltd.), 3% by weight with an average particle diameter of 1.0 μm μm and transition temperature T g Glass frit at 350°C, 0.1% by weight BET specific surface area of ​​200±25m 2 / g of fumed silica ( 200, Evonik Co., Ltd.), 0.2% by weight of dispersant ( 102, BYK) and 0.5% by weight of thixotropic agent ( ST, Elements Co., Ltd.) was added to the binder solution, and then mixed and kneaded in a 3-roll mill to prepare a screen-print...

Embodiment 2

[0157] Metallization Pastes Containing Siloxanes

[0158] Silicone-containing metallization pastes were prepared from the ingredients listed in Table 2.

[0159] Table 2. Metallization Paste B Containing Silicone.

[0160]

[0161]

[0162] As in Example 1, metallization pastes were prepared and applied to monocrystalline solar cells.

[0163] The shear rate-dependent viscosity of silicone-containing metallization paste B is shown in figure 1 middle.

[0164] Metallization paste B (Example 2) had a viscosity of 427 Pa-sec at 1 / sec shear rate and had a FoG of 5 μm.

Embodiment 3

[0166] Metallization pastes containing silicone and silicone-modified resins

[0167] Silicone-containing metallization pastes were prepared from the ingredients listed in Table 5.

[0168] Table 5. Silicone-containing metallization paste B.

[0169]

[0170] Metallization pastes containing polysiloxane and polysiloxane-modified resins were applied to monocrystalline solar cells as described in Example 2 and fired to obtain a fine grid on the front surface of the solar cell Wire.

[0171] The shear rate-dependent viscosity of silicone-containing metallization paste C is shown in figure 1 middle.

[0172] Metallization paste C has a viscosity of 370 Pa-sec at 1 / sec shear rate and has a FoG of 5 μm.

[0173] Electroluminescence (EL) images of solar cells with grid lines prepared using the metallization paste of Example 1 and using the metallization paste of Example 3 are shown in Figure 2A and Figure 2B middle.

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Abstract

The front side metallization paste for solar cell electrodes contains siloxane. Silicone-containing metallization pastes can be used to create fine-line, high-aspect-ratio solar cell gridlines.

Description

technical field [0001] A screen printable metallization paste for making solar cell electrodes is disclosed. The solar cell metallization paste contains siloxane. Background technique [0002] Solar cells are fabricated in high volumes using high-throughput production methods. In high-volume production, the solar cell metallization paste can be screen printed at a rate of 3,500 wafers / hour. To reduce cost and improve solar cell performance, it is desirable to reduce the size of the front electrode. In mass production, the metallization paste is usually screen printed through a fine wire mesh to make the front electrodes. When printing the metallization paste through a screen with openings smaller than 38 μm, it is challenging to achieve overall fine line front grid metallization with an aspect ratio greater than about 0.4 and no discontinuities. Currently, the screen opening may be about 34 μm. As the slurry travels through the screen openings in the wire mesh, line dis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B3/00H01L31/0224H01B13/00H01L31/18H01B1/02
CPCH01L31/02245H01B1/16H01B1/22Y02E10/547H01L31/068H01L31/0284C09D5/24B05D5/12
Inventor 穆罕默德·M·西拉理张威李志勇
Owner ZHEJIANG KAIYING NEW MATERIAL