Electronic Device Module Comprising an Ethylene Multi-Block Copolymer

Inactive Publication Date: 2008-05-22
DOW GLOBAL TECH LLC
View PDF50 Cites 91 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0020]In another embodiment, the invention is the electronic device module as described in the two embodiments above except that the polymeric material in intimate contact with at least one surface of the electronic device is a co-extruded material in which at least one outer skin layer (i) does not contain peroxide for crosslinking, and (ii) is the surface which comes into intimate contact with the module. Typically, this outer skin layer exhibits good adhesion to glass. This outer skin of the co-extruded material can comprise any one of a number of different polymers, but is

Problems solved by technology

No one polymeric material delivers maximum performance on all of these properties in any particular application, and usually trade-offs are made to maximize the performance of properties most important to a particular application, e.g., transparency and protection against the environment, at the expense of properties secondary in importance to the application, e.g., cure time and cost.
EVA resins are typically stabilized with ultra-violet (UV) light additives, and they are typically crosslinked during the solar cell lamination process using peroxides to improve heat and creep resistance to a temperature between about 80 and 90 C. However, EVA resins are less than ideal PV cell encapsulating film material for several reasons.
This discoloration can result in a greater than 30% loss in power output of the solar module after as little as four years of exposure to the environment.
EVA resins also absorb moisture and are subject to decomposition.
One of the most fundamental limitations on the efficiency of a solar cell is the band gap of its semi-conducting material, i.e., the energy required to boost an ele

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic Device Module Comprising an Ethylene Multi-Block Copolymer
  • Electronic Device Module Comprising an Ethylene Multi-Block Copolymer

Examples

Experimental program
Comparison scheme
Effect test

Example

Example B

[0086]A monolayer 15 mil thick protective cast film is made from a blend comprising 90 wt % ethylene / 1-octene multi-block copolymer (5 MI, 0.87 g / cc overall density; 30% hard segment, 70% soft segment having a density of about 0.85 g / cc), 10 wt % maleic anhydride (MAH) modified ethylene / 1-octene (ENGAGE® polyolefin grafted at a level of about 1 wt % MAH and having a post-modified MI of about 1.25 g / 10 min and a density of about 0.87 g / cc), 0.1 wt % of Chimassorb® 944, 0.2 wt % of Naugard® P, and 0.3 wt % of Cyasorb® UV 531. A Solar cell module is prepared using a solar cell lamination process at 150 C in which the protective film is located between a transparent superstrate (usually glass) and the solar cell, and between the solar cell and a backskin material.

Formulation and Processing Procedures:

[0087]Step 1: Use ZSK-30 extruder with Adhere Screw to compound resin and additive package with Amplify.

[0088]Step 2: Dry the material from Step 2 for 4 hour at 100 F maximum (use ...

Example

Example C

Block Copolymer Polyolefin-Based Encapsulant Film

[0096]An ethylene / 1-octene block copolymer developed by The Dow Chemical Company is used for this example. The density of this resin is 0.877 g / cm3 and melt index is 5 g / 10 min (measured based on standard ASTM D1238, condition 190 C / 2.16 kg). The resin contains 1000 ppm of antioxidant Irganox-168. Several additives are selected to add functionality or improve the long term stability of the resin. The additives are UV-absorbent Cyasorb UV 531, UV-stabilizer Chimassorb 944 LD, antioxidant Tinuvin 622 LD, vinyltrimethoxysilane (VTMS), and peroxide Luperox-101. The formulation (by weight) is listed in Table 3.

TABLE 3Film FormulationFormulation ComponentWeight percentEthylene / 1-octene block copolymer98.45(MI 5, 0.877 den.)Cyasorb UV 5310.3Chimassorb 944 LD0.1Tinuvin 622 LD0.1Irganox-168Silane (Dow Corning Z-6300)1Luperox-1010.05Total100

TABLE 4Ethylene / 1-Octene Block Copolymer CompositionOverallOcteneOcteneOverallOcteneOcteneOctene...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Fractionaaaaaaaaaa
Percent by massaaaaaaaaaa
Densityaaaaaaaaaa
Login to view more

Abstract

An electronic device module comprises:
    • A. At least one electronic device, e.g., a solar cell, and
    • B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer.
Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of U.S. Provisional Application No. 60 / 826,319 filed Sep. 20, 2006 and U.S. Provisional Application No. 60 / 865,953 filed Nov. 15, 2006.FIELD OF THE INVENTION[0002]This invention relates to electronic device modules. In one aspect, the invention relates to electronic device modules comprising an electronic device, e.g., a solar or photovoltaic (PV) cell, and a protective polymeric material while in another aspect, the invention relates to electronic device modules in which the protective polymeric material is an ethylene multi-block copolymer. In yet another aspect, the invention relates to a method of making an electronic device module.BACKGROUND OF THE INVENTION[0003]Polymeric materials are commonly used in the manufacture of modules comprising one or more electronic devices including, but not limited to, solar cells (also known as photovoltaic cells), liquid crystal panels, electro-luminescent devices ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L31/00
CPCB32B17/10018B32B17/10678B32B17/10697H01L31/0481Y02E10/50C08F210/02H01L31/048
Inventor PATEL, RAJEN M.WU, SHAOFUBERNIUS, MARK T.ESSEGHIR, MOHAMEDMCGEE, ROBERT L.MAZOR, MICHAEL H.NAUMOVITZ, JOHN
Owner DOW GLOBAL TECH LLC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap