The invention provides high-temperature-resistant black
exposure and development
printing ink, a method for preparing the same and application. The high-temperature-resistant black
exposure and development
printing ink is applied to the field of decoration of different types of 3D (three-dimensional) curved glass and special-shaped glass. The high-temperature-resistant black
exposure and development
printing ink is double-component printing ink. A component A of the high-temperature-resistant black exposure and development printing ink comprises
epoxy resin,
polyester resin, fillers,
carbon black, auxiliaries, photoinitiators and
cyclohexanone. A component B of the high-temperature-resistant black exposure and development printing ink comprises closed curing agents and
butyl acetate. Diluents comprise
butanone,
butyl acetate and MIBK (
methyl isobutyl ketone). The high-temperature-resistant black exposure and development printing ink, the method and the application have the advantages that the curing agents and the diluents can be proportionally added, then the high-temperature-resistant black exposure and development printing ink can be sprayed, 1%
sodium carbonate solution can besprayed for 30-90 seconds after the high-temperature-resistant black exposure and development printing ink is preliminarily baked and exposed, unexposed regions can be quickly faded, clear images canbe displayed, and the high-temperature-resistant black exposure and development printing ink is free of residues; the high-temperature-resistant black exposure and development printing ink can be ultimately baked at the temperatures of 150-180 DEG C for 30 minutes, the dried high-temperature-resistant black exposure and development printing ink is excellent in insulating property and good in adhesion, has a high OD (
optical density) value and can
resist high temperatures, and the problems of low yield and efficiency and high cost of the traditional decoration technologies for 3D curved glass and special-shaped glass can be effectively solved.