A wireless transmission module and its manufacturing method

Abstract

The application discloses a wireless transmission module and a manufacturing method thereof. The module integrates chips, passive components and coils into one structure, thereby improving the integration degree of the wireless transmission module. Moreover, the integrated structure can effectively realize the independence of the module, and the independent module can be flexibly arranged inside the whole electronic device, and there is no need to set the independent module on the main board of the electronic device, only the electronic The input terminal of the wireless transmission module is reserved on the main board of the device, so the wireless transmission module occupies a small board area. Moreover, the integrated structure can effectively improve the ability of the product to continue to work normally in extremely harsh scenarios and improve the reliability of the product. In addition, in the structure of the wireless transmission module, the chip and the coil are integrated into one body, and the signal transmission path between the chip and the coil is relatively short, so the generated parasitic impedance is relatively small.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a wireless transmission module and a manufacturing method. Background technique [0002] Wireless charging, NFC (Near Field Communication, short-range wireless communication technology) and other wireless transmission modules use electromagnetic fields to transmit signals / energy between transmitters and receivers, and are widely used in various types of electronic devices. [0003] At present, an assembly structure of wireless transmission modules and electronic equipment is as follows: figure 1 , where (a) is a top view of the assembly structure, and (b) is a schematic cross-sectional view of the assembly structure. Such as figure 1 As shown, the chip 11 and the passive components 12 are mounted on the main board 13 of the electronic device, and the coil and the magnetic material 14 are arranged outside the main board 13 (generally arranged near t...

AI Technical Summary

Problems solved by technology

like figure 1 As shown, the chip 11 and the passive components 12 are mounted on the main board 13 of the electronic device, and the coil and the magnetic material 14 are arranged outside the main board 13 (generally arranged near the position of the complete machine shell of the electronic device), thus, the wireless transmission mode The coil of the group is separated from the chip 11, resulting in low integration of the wireless transmission module

In the wireless transmission module with a low integration level, both the chip 11 and the passive components 12 need to be mounted on the main board 13, resulting in the wireless transmission module occupying a large area of ​​the main board 13 of the electronic equipment, which is not conducive to electronic equipment. miniaturization and thinning

[0004] In addition, the sensitive components in the wireless transmission module, such as the chip 11 and the passive components 12, are directly mounted on the motherboard of the electronic device, so the sensitive components are exposed to the external environment and are easily damaged, making the product reliable. lower sex

[0005] Moreover, the chip 11 is separated from the coil, and the circuit path is relatively long, which will generate a large parasitic impedance

And larger parasitic impedance will reduce the power density of the module

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