Method for making double-sided wire-buried printed circuit board by using imageable dielectric material

Abstract

The invention relates to a method for making a double-sided wire-buried printed circuit board by using an imageable dielectric material. The method comprises the following steps: (a) firstly, providing a detachable core board, and arranging a carrier copper foil and an auxiliary copper foil on the surface of the core board; (b) making a first line pattern on the surface of the auxiliary copper foil; (c) laminating the imageable dielectric material on the first line pattern to form a first buried line; (d) locating by using the first line pattern to form a sinking type line slot and a counterbore with a certain depth; (e) locating by using the first line pattern, and processing counterbore again with laser so as to make a complete through hole; (f) carrying out copper plating on the imageable dielectric material, and fully filling the sinking type line slot and the through hole with copper; (g) removing the plated copper on the surface of the imageable dielectric material to form a second buried line; (h) disassembling the detachable core plate to remove the auxiliary copper foil on the surface of the first line pattern; (i) forming a solder mask on the surface of the circuit boardand carrying out surface treatment to obtain the double-sided wire-buried printed circuit board.

Description

technical field [0001] The invention relates to the manufacturing technology of printed circuit boards or semiconductor integrated circuit packaging substrates, in particular to a method for making double-sided embedding printed circuit boards with imageable dielectric materials. Background technique [0002] With the continuous advancement of science and technology, the electronics industry has developed rapidly, and electronic products have already entered the stage of functional and intelligent development. In order to better meet the needs of high integration and miniaturization of electronic products, printed circuit boards or semiconductor integration On the premise of ensuring good electrical and thermal properties of electronic products, circuit packaging substrates are also developing in the direction of lightness, thinness, shortness and smallness. [0003] Because the design of printed circuit boards or semiconductor integrated circuit packaging substrates is gett...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for making double-sided embedding printed circuit boards with imageable dielectric materials, which can solve the problem of poor alignment between embedding layers, and at the same time avoid the problem of open circuit caused by excessive copper reduction, which can be more Better guarantee the quality of double-sided embedding printed circuit boards

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