A Fine Etching Process for Printed Board

Abstract

The invention discloses a fine etching process of a printed board. The fine etching process comprises the steps of S2, manufacturing an etching machine, rotatably mounting a rotating shaft at two sides of an etching trough, mounting a handwheel at one end of the rotating shaft, welding a bearing platform on the rotating shaft, processing two blind holes at top of the bearing platform, welding extension springs in the blind holes, welding a pressure board on top of the spring, and ensuring a fact that the pressure board abuts against top of the bearing platform through a pulling force functionof the spring; finally, mounting an air compressor on the side wall of the etching trough, and connecting the air outlet of the air compressor with an air outlet pipe, thereby manufacturing the etching machine; and S6, fixedly mounting a vertically arranged oil cylinder on a portal frame, mounting a motor on the action end of the piston rod of the vertical oil oil cylinder, welding a basket on theoutput shaft of the motor, placing a baking oven below the basket, and arranging a through trough on top of the baking oven. The fine etching process has beneficial effects of etching cost reduction,recycling of inorganic acid, high drying efficiency, high drying quality, simple operation and mechanical strength improvement of the printed board.

Description

technical field [0001] The invention relates to a fine etching process of a printed board. Background technique [0002] The circuit layer on the printed circuit board substrate is etched by the etching solution. Before etching, the parts that do not need to be etched are pasted with tape, and then the circuit board is placed in the tank body containing the etching solution for etching, and the etching solution is corroded. Remove the copper material that is not covered by the tape, and when the tape is removed, the desired circuit layer is obtained. However, when the workers salvage the circuit board from the tank, the surface of the circuit board has etchant attached to it, and the etchant is transported to the subsequent cleaning process along with the circuit board, resulting in a drop in the level of the etchant in the tank. , at this time, a new etching solution needs to be supplemented, resulting in an increase in cost. The printed circuit board is formed by alterna...

AI Technical Summary

Problems solved by technology

However, during the baking process in the oven, a large number of water droplets adhere to the surface of the circuit board. During the drying process, it takes a long time to evaporate the water droplets, which reduces the drying efficiency.