Low-temperature and high-adhesion conductive silver paste

A high-adhesion, conductive silver paste technology, used in conductive adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve problems such as short shelf life, high curing temperature, and strict storage conditions , to achieve the effect of improving production efficiency and yield, short drying and curing time, and good storage stability

Inactive Publication Date: 2018-12-14
苏州艾达仕电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the conductive silver adhesives on the market are two-component systems that use epoxy resin as the base resin and different types of amino resins as the curing agent, and use ultra-fine silver powder as the conductive medium. Between 60% and 70%, the cost is also relatively high. This type of silver glue still has two major defects. One is that it requires strict storage conditions, poor stability, and a short shelf life; the other is that the curing temperature is high and the time is long. It takes 20-30 minutes or longer to cure at 150°C, which is not conducive to the improvement of production efficiency; therefore, how to overcome the above technical problems has become the direction of efforts of ordinary skilled in the art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~4

[0024] Embodiments 1 to 4: A low-temperature high-adhesion conductive silver paste, consisting of the following components by weight, as shown in Table 1:

[0025] Table 1

[0026]

Embodiment 1

[0027] The conductive filler in Example 1 is a mixture formed by mixing silver powder and silver nanowires in a ratio of 100:30 parts by weight; the conductive filler in Example 2 is a mixture formed by mixing silver powder and silver nanowires in a ratio of 100:28 parts by weight; The conductive filler in embodiment 3 is a mixture formed by mixing silver powder and silver nanowires in a ratio of 100:32 parts by weight; the conductive filler in embodiment 4 is a mixture formed by mixing silver powder and silver nanowires in a ratio of 100:38 parts by weight;

[0028] The diameter of the silver powder is 2-8 μm, the length of the silver nanowire is 20-200 μm, and the diameter is 20-100 nm.

[0029] The antifoaming agent of embodiment 1 and 2 is sodium dodecylsulfonate, and the antifoaming agent of embodiment 3 and 4 is 4,4-diaminodiphenylmethane.

[0030] A kind of preparation technology of above-mentioned low-temperature high-adhesion conductive silver paste, comprises the fol...

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Abstract

The invention discloses a low-temperature and high-adhesion conductive silver paste which is composed of the following components in parts by weight: conductive fillers, polyurethane resin, glyceryl ether epoxy resin, polyether, hydrogenated castor oil, dicyandiamide, hexahydrophthalic anhydride, N, N-dipropyl-1-propylamine, neopentyl glycol glycidyl ether, Gamma-aminopropyltriethoxysilane, a defoaming agent, methylisobutylketone and cyclohexanone, wherein the conductive fillers are mixtures formed by mixing a silver powder with silver nanowires at a weight ratio of 100 to 25-40; the silver powder has a diameter of 2-8 Mum; the silver nanowires have a length of 20-200 Mum and the diameter of 20-100 nm. The low-temperature and high-adhesion conductive silver paste provided by the inventioncan be stored for 12 months at an ambient temperature below 15 DEG C, has good storage stability, and can be dried and cured in 100 seconds at 120 DEG C, thereby improving the production efficiency and the yield.

Description

technical field [0001] The invention relates to the field of conductive silver paste, in particular to a low-temperature high-adhesion conductive silver paste. Background technique [0002] Conductive silver glue has been widely used in the electronics industry, mainly for bonding conductive objects between different materials. At present, most of the conductive silver adhesives on the market are two-component systems that use epoxy resin as the base resin and different types of amino resins as the curing agent, and use ultra-fine silver powder as the conductive medium. Between 60% and 70%, the cost is also relatively high. This type of silver glue still has two major defects. One is that it requires strict storage conditions, poor stability, and a short shelf life; the other is that the curing temperature is high and the time is long. It takes 20-30 minutes or longer to cure at 150°C, which is not conducive to the improvement of production efficiency; therefore, how to ove...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J175/04C09J163/00C09J11/08C09J11/06
Inventor 叶旭东胡曰康
Owner 苏州艾达仕电子科技有限公司
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