A novel process for realizing pattern transfer on a sheet (including wafer)

Abstract

The invention discloses a novel process for realizing pattern transfer on a sheet (including a wafer), comprising the following steps: providing a sheet to be processed; Placing the sheet on a workbench; A vision alignment system and a laser cutting system are arranged above the workbench, and the vision alignment system feeds back data of the integral position of the sheet and the position of each chip in the sheet to the control system; And then coating a thin film (or coating an anti-corrosion medium layer) on the surface of the thin sheet; The control system calculates the preset figure and the position data to obtain the figure machined on the surface of the sheet, and transmits the figure to the laser cutting system. A lase beam carries out groove cutting on a thin film (or an anti-corrosion medium layer) cover on that surface of the sheet, and removes a thin film (or an anti-corrosion medium layer) in a set groove width according to a pattern; At last, wet etch or dry etching iscarry out on that sheet, and the pattern is transferred to the sheet; According to the invention, the purpose of transferring the pattern on the thin film (or anti-corrosion medium layer) onto the sheet can be achieved.

Description

technical field [0001] The present invention relates to the field of production and manufacture of semiconductor integrated circuits, electronic components, various sensors, MEMS devices, etc., and particularly relates to how to provide anti-corrosion protection for thin films (or coatings) on the surface of thin slices (including wafers) Dielectric layer) for laser grooving and cutting to form the patterns required in the above-mentioned various circuits and device processing, and transfer the pattern to the sheet (including the wafer) in the subsequent wet or dry etching process A new process, so as to realize various graphics and low-cost slotting or through-cutting of thin slices (including wafers). Background technique [0002] At present, the main process technologies and processing methods for slotting or penetrating cutting of thin slices (including wafers) on the market are: first, mechanical methods, using grinding wheel blades or ordinary blades with the cooperati...

AI Technical Summary

Problems solved by technology

[0010] First, after the laser beam performs surface groove cutting on the thin slice (including the wafer) or performs stealth cutting inside the thin slice (including the wafer), the thin slice (including the wafer) must be expanded and split in order to cut the thin slice (including the wafer) Each chip in the wafer) is separated. This mechanical expansion split also causes a certain degree of mechanical damage on the surrounding surface and side walls of the chip and leaves stress residues, which reduces the yield and reliability of the chip. ;

[0011] Second, when the size of the chip on the sheet (including the wafer) is small (for example, in the case of 500um×500um and below), reciprocating cutting is required on a sheet with a length and width of 300mm (or a wafer with a diameter of 300mm) It takes thousands of times to complete slotting or penetrating cutting. At the same time, laser stealth cutting often requires multiple cuttings at different depths in the same cutting line to facilitate the subsequent expansion and splitting process. Affected by the upper limit of cutting speed, it will inevitably cause production inefficiency;

[0012] Third, although laser grooving and cutting can achieve a certain width of grooving between each chip, it is difficult for the material of the sheet (including the wafer) to be vaporized at high temperature during the laser cutting process (especially including but not limited to various semiconductors). Crystal, glass, crystal, ferrite, ceramics, etc.), the remaining material will re-condense around the chip or in the groove to form a nodular residue, which will definitely affect the effectiveness of the groove and reduce the yield of the chip;

[0013] Fourth, laser stealth cutting not only requires expensive laser equipment, but also requires expensive slitting equipment for the subsequent expansion slitting process, which will inevitably cause the overall equipment cost to be expensive

[0014] However, when using the pattern transfer method of the present invention to perform slotting or penetrating cutting on thin slices (including wafers), not only can avoid the process problems and technical limitations in the above two process technologies and processing methods, and the current market A precedent that has not yet been adopted

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