Printed circuit board (PCB) high current test method

Abstract

The invention discloses a printed circuit board (PCB) high current test method. The PCB high current test method comprises the steps of front resistance measurement, high current test, cooling, rear resistance measurement and resistance change rate calculation. Through the test of the five steps, the PCB high current test method can detect the problems in PCB products such as hole-bottom separation, non-penetrating lasers, laser no marking, blind-hole hole breakout, through-hole hole breakout, welding missing, laser breakdown, hole-bottom defective gum, foreign matter hole breakout, surface copper deficiency, through-hole ICD, bind-hole hole copper deficiency, small laser perforations, blind-hole folding plating, through-hole folding plating, copper powder inside holes, small laser holes and electroplating hole breakout; during the test, no damage is caused to the PCB products, the shipment of the products is not affected, and non-destructive test is achieved; and the consumed time oftest is relatively short, batch test can be carried out, the timeliness is good, the defect problems can be quickly fed back so as to timely adjust and improve the production process and avoid unnecessary scrap loss.

Description

Technical field [0001] The invention relates to the technical field of PCB testing, in particular to a PCB high-current testing method. Background technique [0002] PCB (PrintedCircuitBoard), the Chinese name is printed circuit board. As an important carrier of electronic components, PCB is combined with numerous electronic components to construct various electronic products that can be seen in life. Mobile phones, smart watches, computers, televisions, cars, satellites, space shuttles... [0003] With the advancement of science and technology, human living standards have been greatly improved, and people have put forward higher requirements for the safety and reliability of electronic products. Maybe the phone or computer occasionally black screen, you only need to reset or restart it, that will only affect your experience; if the battery of the phone catches fire and explodes, if the vehicle suddenly goes out of control at high speed, if the fighter missile suddenly fails. , ...

AI Technical Summary

Problems solved by technology

In such a high-temperature process, the thermal expansion of the PCB board may cause problems in the connection of the inner layer circuits. Such problems will affect the integrity of the signal transmission of the PCB circuit, and there may also be a potential risk of electronic product function failure.

Usually this kind of problem has a higher level in the risk of PCB boards, and the scope of influence is wider, which will lead to huge economic compensation losses for PCB board production factories.

[0006] At present, most PCB board simulation tests use tests such as IR test, test, hot oil test, TCT, IST and other tests. The above test methods cannot be applied in the process of semi-finished products. The test takes a long time and cannot be batched. Operation, every There are certain defect detection blind spots in all kinds of test methods, and most of the tests are destructive verification, and only sample verification can be carried out

Such as thermal stress test, the porosity cannot be monitored, it needs to be observed through random slices, and it cannot be batch-operated

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