A high temperature multi-gradient and high welding permeability method for sintering millimeter wave transceiver module
A technology of transceiver components and sintering method, which is applied in the high-temperature, multi-gradient, high-penetration sintering field of millimeter-wave transceiver components, which can solve problems such as large void rate in manual soldering, chip sintering offset, chip edge damage, etc., and achieve good microwave grounding capability and the effect of heat dissipation
Active Publication Date: 2018-12-18
SPACE STAR TECH CO LTD
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Problems solved by technology
However, there are many problems in the traditional sintering process: high manual soldering void rate, multi-substrate and multi-chip sintering offset, serious chip edge damage, etc. At the same time, there are many types of components in the product assembly process, which requires multiple sintering with different temperature gradients
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[0020] Hereinafter, the present invention will be described in detail based on the drawings.
[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection of the present invention. scope.
[0022] The key factors affecting the penetration rate are the coating state and sintering pressure, and the coating state is mainly the coating material and coating thickness.
[0023] Plating Au, Ag, Ni, Sn-Pb, Cu-Sn-Zn on the surface of aluminum alloy (sili...
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A high temperature multi-gradient and high welding permeability method for sintering a millimeter wave transceiver module. Based on the analysis of the key factors affecting the penetration rate, hightemperature multi-temperature gradient vacuum sintering technology to carry out multi-gradient high welding permeability sintering technology research, Under the requirements of multi-temperature gradient and high welding permeability, the design of operable sintering process can achieve good microwave grounding ability and heat dissipation ability. The design scheme is suitable for millimeter wave transceiver module, especially for multi-temperature gradient products.
Description
technical field [0001] The invention belongs to the technical field of high-temperature sintering, and relates to a high-temperature, multi-gradient, high-penetration sintering method for a millimeter-wave transceiver component. Background technique [0002] Microwave power chips are widely used in millimeter wave transceiver components and play an important role in microwave communication. Microwave circuits usually have a high frequency, so the grounding condition of the chip affects the circuit crosstalk and insertion loss, and at the same time brings additional capacitance and oscillation. The high-power MMIC chip matrix material GaAs used in the transmitting part of the transceiver component has poor thermal conductivity, so the connection between the chip and the substrate must have very good microwave grounding capability (low ohm contact) and good heat dissipation. The penetration rate directly reflects the grounding effect and heat dissipation capability, and is a ...
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IPC IPC(8): H01L21/603
CPCH01L24/83H01L2224/83203H01L2224/8321
Inventor 余定展郑斌孙健杨晓媛
Owner SPACE STAR TECH CO LTD