Automatic stamping system

Abstract

The invention provides an automatic stamping system which comprises a feeding unit, a stamping unit, a transferring unit and a control unit. The feeding unit comprises a feeding platform, a stacking device and a pushing assembly; the pushing assembly is located on the outer side of the stacking device; a feeding end is arranged on the feeding platform; and the pushing assembly pushes material slices in the stacking device to the feeding end. The stamping unit comprises a stamping machine, a stamping die, an air blowing assembly and a material slice collecting assembly; a die cavity is formed in the stamping die in a penetrating mode; a punch of the stamping machine is located over the die cavity; the material slice collecting assembly is located below the die cavity; and the air blowing assembly blows waste out of the die cavity. The transferring unit transfers the material slices from the feeding end onto the die cavity. The control unit controls the feeding unit, the stamping unit and the transferring unit to operate. According to the automatic stamping system, feeding, stamping and discharging can be automatically conducted, the machining efficiency of the material slices is high, and the machining process is safe and reliable.

Description

technical field [0001] The invention relates to the technical field of metal processing, in particular to an automatic stamping system for processing metal sheets. Background technique [0002] Some high-power RF electronic components on the printed circuit board (PCB) generate a lot of heat. In order to effectively solve the problem of heat dissipation, copper or aluminum with high thermal conductivity is usually embedded in the PCB by sol bonding. Heat sinks help to dissipate heat from RF electronics. Since the PCB and heat sink are made of different materials, the thermal expansion coefficients of the two are different. If the bonding strength does not meet the process requirements, cracks will easily occur at the junction due to temperature changes during later use, causing the entire PCB board to be scrapped. Tests have proved that the bonding strength between the PCB and the heat sink is related to many factors, among which the side surface quality of the heat sink is...

AI Technical Summary

Problems solved by technology

The existing method not only has the problems that the blanks are not easy to put in place, and the waste is not cleaned thoroughly, which may easily cause damage to the mold, but also the workers are engaged in repetitive labor for a long time during production, which is easy to cause burnout, and there is a large potential safety hazard

In addition, this method can only use the traditional one-person-one-machine operation mode, and it is difficult to effectively improve the production efficiency.

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