Connecting tape special for high-speed SMT chip mounter and preparation method thereof

Abstract

The invention provides a connecting tape special for a high-speed SMT chip mounter and a preparation method thereof. A tape substrate is 25 and 36 micron PET, the tensile strength of the PET DM is greater than 150Pa, CD is greater than 120Pa, and the PET coating surface undergoes surface corona treatment to have a surface energy of 56-60 DN; the PET coating surface is coated with glue, and the glue includes acrylic pressure sensitive adhesive, isocyanate, melamine hardener and solvent. The molecular weight of the acrylic pressure sensitive adhesive is 500000-800000, and the solid content is 40% to 45%; the acrylic pressure sensitive adhesive, the isocyanate and the melamine hardener are added at a mass part proportion of 100:2.5-3.0:0.5-0.8, and uniform stirring is performed through a stirring device; and silicone oil release PET backing paper is attached after the glue is dried.

Description

technical field [0001] The invention belongs to the field of adhesive tape materials, and in particular relates to a splicing adhesive tape specially used for high-speed SMT placement machines and a preparation method thereof. Background technique [0002] In order to achieve a tape that can be used by SMT placement machines to connect electronic components, thereby reducing the downtime of SMT placement machines, while saving time and improving cost-effectiveness, the product is divided into single-sided splicing tape (various specifications 8MM , 12MM, 16MM, 24MM, 32MM) and double-sided connecting tape (single and bilateral hole positioning). [0003] Solve the problem of all-round connection tape for automatic SMT placement machines of electronic products in the existing market. Operators can directly connect and use without connecting pliers, making the connection tape more reasonable, convenient and fast, and making the SMT placement machine run at high speed. Create m...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: on the basis of the splicing adhesive tape specially used for high-speed SMT placement machines, no corona treatment is performed on the surface, and a new type of surface layer is used to add materials so that the additives on the lower surface of the film do not migrate to other surfaces. One surface layer is removed, so that it will not affect the adhesion of ink on the surface of the film, so that the film has a more durable and effective printing or coding function; and the film still maintains the original good machine applicability, good stiffness, high elastic modulus, Excellent optical performance, effectively solving the problem that ordinary cigarette packaging films cannot maintain surface printing or coding capabilities for a long time

Images