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Preparation method of micro-nano structure

A micro-nano structure, one-sided technology, applied in the field of micro-nano, can solve the problems of cumbersome preparation methods of micro-nano structure, unfavorable practical application of micro-nano technology, etc., and achieve the effect of simple method

Inactive Publication Date: 2019-01-01
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, when preparing micro-nano structures, it is usually necessary to prepare a mask first, and then etch on the mask to obtain micro-nano structures, which makes the preparation method of micro-nano structures cumbersome, which is not conducive to promoting the practical application of micro-nano technology.

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  • Preparation method of micro-nano structure

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preparation example Construction

[0028] The invention provides a method for preparing a micro-nano structure, comprising the following steps:

[0029] (1) Covering the glass sheet on one side of the metal substrate to obtain the substrate;

[0030] (2) plasma etching is carried out on the side of the glass sheet covered with the substrate obtained in the step (1), and a micro-nano structure is formed on the surface of the glass sheet; the plasma etching gas includes fluorine-containing gas and Ar .

[0031] In the present invention, a glass sheet is partially covered on one side of a metal substrate to obtain a matrix.

[0032] In the present invention, the material of the metal substrate preferably includes stainless steel, aluminum or copper.

[0033] In the present invention, the material of the glass sheet preferably includes one or more of quartz glass, borosilicate glass and radiation-resistant glass.

[0034] In the present invention, the ratio of the area of ​​the metal substrate to the glass sheet...

Embodiment 1

[0045] Place the quartz glass sheet on the metal substrate to form a substrate, place the substrate in the reaction chamber of the plasma etching device, and then pass through CHF 3 and Ar for plasma etching to form micro-nano structures. of which CHF 3 The gas flow rate of Ar is 10 sccm, the gas flow rate of Ar is 50 sccm, the time of plasma etching is 30 min, the pressure of plasma etching is 3Pa, and the power of plasma etching is 500W.

[0046] The scanning electron microscope picture of the micro-nano structure prepared in Example 1 is as follows figure 2 , image 3 and Figure 4 shown, where figure 2 for top view, image 3 for oblique view, Figure 4 for side view. The average height of the micro-nano structure is 528nm, the number is 428, and the total area of ​​the micro-nano structure is 2.182×10 6 nm 2 , The maximum transmittance of the quartz glass sheet is 96.46%, which effectively improves the anti-reflection performance of the quartz glass sheet.

Embodiment 2

[0048] Put BK7 borosilicate glass on the metal substrate to form a matrix, place the matrix in the reaction chamber of the plasma etching device, and then pass it into CHF 3 and Ar for plasma etching to form micro-nano structures. of which CHF 3 The gas flow rate of Ar is 15 sccm, the gas flow rate of Ar is 40 sccm, the time of plasma etching is 30 min, the pressure of plasma etching is 10 Pa, and the power of plasma etching is 200W.

[0049] The scanning electron microscope picture of the micro-nano structure prepared in embodiment 2 is as follows Figure 5 and Image 6 shown, where Figure 5 for top view, Image 6 For oblique view. The average height of the micro-nano structure is 150nm, the number is 836, and the total area of ​​the micro-nano structure is 7.455×10 5 nm 2 , The highest transmittance of BK7 borosilicate glass sheet is 95.13%, which effectively improves the anti-reflection performance of BK7 borosilicate glass sheet.

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Abstract

The invention provides a preparation method of a micro-nano structure. The preparation method comprises the following steps; covering a single-face part of a metal substrate with a glass sheet, so asto obtain a base body; carrying out plasma etching on one face, covered with the glass sheet, of the base body, so as to obtain the micro-nano structure, wherein gas for the plasma etching includes fluorine-containing gas and Ar. The preparation method of the micro-nano structure, provided by the invention, is simple; it can be seen from the embodiment of the invention that the micro-nano structure prepared by the preparation method provided by the invention has a relatively good appearance.

Description

technical field [0001] The invention relates to the field of micro-nano technology, in particular to a method for preparing a micro-nano structure. Background technique [0002] The scale of the micro-nano structure generally belongs to the micro-nano scale, so its processing belongs to the category of micro-nano processing. The general idea of ​​micro-nano processing is to first prepare a layer of mask on the surface of the substrate, then obtain the design pattern by selective etching, and finally remove the template to obtain the micro-nano structure. The process of processing involves two main processes, namely the template preparation process and the etching process. [0003] In micro-nano processing methods, mask technology is an equally important preparation technology as etching technology. As far as the current development is concerned, mask technology is the main factor limiting the development of anti-reflective micro-nano structures. Common mask technology inc...

Claims

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Application Information

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IPC IPC(8): B81C1/00
Inventor 叶鑫胡锡亨邵婷伍景军石兆华夏汉定李青芝刘红婕杨李茗郑万国吴卫东黄进王凤蕊
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS