A kind of bulb planting method and device
A technology of planting balls and spheres, which is applied to semiconductor devices, printed circuits, electrical components, etc., can solve the problems of low bonding force between ball planting and metal plating, insufficient bonding surface between ball planting and solder paste, and falling off
Active Publication Date: 2020-10-30
江西华讯方舟智能技术有限公司
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Problems solved by technology
During the reflow soldering process, the solder paste cannot fully melt on the metal coating and absorb the metal coating and the balling, so that the bonding surface between the balling and the solder paste is not enough during the curing process, resulting in a small bonding force between the balling and the metal coating after curing , easy to fall off from the metal coating under external force
[0003] Therefore, in the existing ball planting process, the connection between ball planting and metal plating is not firm
Method used
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Embodiment Construction
[0038] In one embodiment, such as figure 1 and Figure 6 As shown, a method for implanting a ball is provided, and the method includes the following steps:
[0039] Step 102, placing the ball to be planted 1, the prefabricated board 2 for ball planting, the solder sheet 3 and the ball planted 4 in sequence in the chamber of the ball planting equipment, wherein there is at least one positioning hole in the prefabricated ball planting plate 2, and the surface of the ball planting 1 is provided with There is a metal coating, and the metal coating is set on the reserved solder joint position, the positioning hole is aligned with the metal coating, the solder piece 3 is placed in the positioning hole of the ball planting prefabricated board 2, and the ball planting 4 is placed on the solder piece 3 .
[0040] In the embodiment of the present application, the ball planting 4 can be placed by using tweezers and a magnifying glass.
[0041] The ball planting equipment has a chamber,...
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The invention belongs to the technical field of micro-assembly and provides a ball mounting method and device. The ball mounting method comprises steps of successively placing a to-be-mounted body, aball-mounting prefabricated plate, a welding sheet and a ball in a ball mounting device; carrying out vacummizing on a chamber and charging protective gas so as to clean impurity gas in the chamber; carrying out heating processing on the to-be-mounted body, the ball-mounting prefabricated plate, the welding sheet and the ball in the ball mounting device so as to allow the welding sheet to be in the liquefaction state;; Keeping the weld piece in liquefaction state for a preset time; Cooling treatment is carried out on the planting ball, the planting ball prefabricated board, the welding piece and the planting ball in the planting ball equipment. This reduces the oxygen in the chamber by vacuuming and filling it with nitrogen, so as to reduce the degree of oxidation of the metal coating surface in the heating process, thereby reducing the voids, further increasing the proportion of intermetallic compounds on the contact surfaces between the planting ball and the welding sheet and betweenthe welding sheet and the metal coating, and thereby increasing the firmness of the connection between the welding sheet and the metal coating.
Description
technical field [0001] The invention relates to the technical field of micro-assembly, in particular to a method and device for planting a ball. Background technique [0002] The current BGA packaging technology uses creamy solder paste as the solder between the ball and the metal plating during the ball planting process, and uses a reflow furnace for reflow soldering. During the reflow soldering process, the solder paste cannot fully melt on the metal coating and absorb the metal coating and the balling, so that the bonding surface between the balling and the solder paste is not enough during the curing process, resulting in a small bonding force between the balling and the metal coating after curing , easy to fall off from the metal coating under external force. [0003] Therefore, in the existing ball planting process, the connection between the ball plant and the metal coating is not firm. Contents of the invention [0004] Based on this, it is necessary to provide a...
Claims
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IPC IPC(8): H01L21/60
CPCH01L24/81H05K3/341H05K3/3494
Inventor 范志敏金亮
Owner 江西华讯方舟智能技术有限公司