A manufacturing method of an organic light emitting diode display

Abstract

The invention provides a manufacturing method of an organic light emitting diode display. The manufacturing method comprises the following steps: a switch array layer is fabricated on a substrate; Forming an organic light-emitting display layer on the switch array layer; Forming a thin film encapsulation layer on the organic light emitting display layer; A superhydrophobic film is prepare on thatfilm encapsulation layer by a plasma chemical vapor deposition method, and the thickness of the superhydrophobic film is small than a preset thickness. The manufacturing method of the organic light emitting diode display of the invention can improve the uniformity of the film thickness, the density and the surface bonding performance, and the mura is not easy to occur.

Description

【Technical field】 [0001] The invention relates to the field of display technology, in particular to a method for manufacturing an organic light emitting diode display. 【Background technique】 [0002] Because the organic light-emitting polymer in the organic light-emitting diode is easily eroded by oxygen and water, it produces an oxidation reaction, thereby reducing the efficiency and life of the OLED device; in order to prevent the OLED light-emitting layer from being invaded by water and oxygen, prolong the life of the OLED and improve Luminous efficiency, currently the industry commonly uses a sandwich packaging structure, that is, an inorganic-organic-inorganic packaging structure. In order to ensure strong compactness to block water and oxygen, the surface of the inorganic layer usually does not have good hydrophobicity. [0003] The current preparation of superhydrophobic films mostly uses perfluorosilane, methyl nonafluorobutyl ether, ethyl perfluorobutyl ether, aceto...

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Problems solved by technology

[0002] Because the organic light-emitting polymer in the organic light-emitting diode is easily eroded by oxygen and water, it produces an oxidation reaction, thereby reducing the efficiency and life of the OLED device; in order to prevent the OLED light-emitting layer from being invaded by water and oxygen, prolong the life of the OLED and improve Luminous efficiency. At present, the industry commonly uses a sandwich packaging structure, that is, an inorganic-organic-inorganic packaging structure. In order to ensure strong compactness to block water and oxygen, the surface of the inorganic layer usually does not have good hydrophobicity.

[0003] The current preparation of superhydrophobic films mostly uses perfluorosilane, methyl nonafluorobutyl ether, ethyl perfluorobutyl ether, acetone, etc. as diluents or raw materials, and then uses molecules containing trihydroxysilicon-based active groups as Silicon reagents, silicon-containing reagents such as perfluorodecyltrimethoxysilane, perfluorooctyltrimethoxysilane, octadecyltrimethoxysilane, etc., and then use the sol-gel method to prepare the mixed substrate, and then spray , printing and other methods to prepare it on the surface of the glass substrate, but due to the thick coating thickness of spraying or inkjet printing, the current inkjet printing technology in the industry is controlled between 4 ~ 12um, while the thickness of the packaging inorganic layer is generally only 1um The spraying method cannot guarantee uniformity, and defects such as mura are prone to occur; the superhydrophobic film prepared by this method has a small water drop angle (about 35 degrees), which makes it difficult to attach materials in the bonding process such as polarizers or protective films. achieve an effective fit

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